Semiconductor apparatus and manufacturing method for semiconductor apparatus
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Solution Overview
Problem
Existing semiconductor apparatuses face challenges with stress-induced reaction forces on lead terminals, leading to increased enclosure size requirements.
Innovation Solution
A semiconductor apparatus design featuring a first external connection terminal with a protruding part and a base part embedded in an insulating resin enclosure, along with recessed parts and extending parts, and a manufacturing method that includes molding the insulating resin enclosure around the terminal to reduce stress and enclosure size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the reaction force from the lead terminal is large, then the structural strength is improved, but the enclosure size increases
Solution Approach 1:
The external connection terminal is divided into multiple functional parts: a base part embedded in the enclosure, a protruding part extending outward, and a recessed part. This segmentation allows each part to perform its specific function optimally while reducing the overall enclosure size requirements.
Solution Approach 2:
The terminal structure utilizes three-dimensional spatial arrangement with the base part embedded in the enclosure body, the protruding part extending in one direction, and the recessed part providing structural relief. This dimensional arrangement distributes stress more effectively without increasing enclosure volume.
2Stability of the object's composition
If the enclosure size is increased to support large reaction forces, then the structural stability is improved, but the device compactness deteriorates
Solution Approach 1:
The enclosure features a locally modified structure with a recessed part that concentrates structural support where needed (at the terminal mounting location) rather than uniformly increasing the entire enclosure. This localized reinforcement maintains stability without compromising compactness.
Solution Approach 2:
The terminal structure combines different material properties and structural configurations (embedded base part in enclosure material, protruding metal contact part, recessed support structure) to achieve both stability and compactness through composite construction.
Data Source
AI summary
A semiconductor apparatus includes: (i) a semiconductor device; (ii) a first external connection terminal configured to be connected to the semiconductor device, and includes a first surface; and a second surface; and (iii) an insulating resin enclosure. The first external connection terminal includes: a base part that is embedded in the insulating resin enclosure; and a protruding part that protrudes from the inner wall of the insulating resin enclosure. The second surface includes: a first part that corresponds to the protruding part; and a second part that corresponds to the base part and is exposed by the first recessed part. The first part and the second part are continuous with each other along a second direction. The first and second extending parts are spaced apart from each other in a third direction. Each of the first and second extending parts extends along the first direction from a position corresponding to the second surface of the first external connection terminal.