Electronic Component Lead Terminal Rigidity Distribution
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Solution Overview
Problem
Existing electronic component assemblies, such as relay modules in electrical junction boxes of moving objects, face deformation issues due to external forces when lead terminals are exposed, as they lack sufficient protection and rigidity distribution.
Innovation Solution
The electronic component assembly features a component main body with lead terminals of varying rigidities, where the highest rigidity lead terminal is positioned to protrude more from the component main body, allowing it to be inserted first into terminal fittings, reducing the load on less rigid terminals and preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lead terminals are made with uniform rigidity, then manufacturing is simplified, but exposed lead terminals deform under external forces during transport and assembly
Solution Approach 1:
The patent applies local quality by varying the rigidity of different lead terminals based on their specific functions and positions. The control unit has different rigidity characteristics for different lead terminals, allowing each to be optimized for its specific role while maintaining overall structural integrity and resistance to deformation under external forces.
2Device complexity
If all lead terminals have the same rigidity, then the structure is simpler, but the assembly process may cause deformation of less rigid terminals during insertion
Solution Approach 1:
The patent implements local quality by assigning different rigidity characteristics to different lead terminals according to their specific functions and positions within the control unit. This allows the structure to remain relatively simple while ensuring that each lead terminal has the appropriate rigidity to withstand assembly forces without deformation.
3Reliability
If lead terminals are protected by housing during transport, then deformation is prevented, but the housing increases the overall size and complexity of the assembly
Solution Approach 1:
The patent applies parameter changes by modifying the rigidity parameters of the lead terminals themselves rather than adding external protective housing. By changing the physical properties (rigidity) of the lead terminals, the patent achieves protection against deformation during transport without increasing the overall volume or complexity of the assembly.
Data Source
AI summary
An electronic component includes a component main body having a rectangular parallelepiped shape and a plurality of lead terminals, and each lead terminal is disposed to droop along a side surface of the component main body facing the lead terminal. The plurality of lead terminals having different rigidities are arranged in a width direction of at least one side surface of the component main body, and the lead terminal having a highest rigidity among the plurality of lead terminals is disposed to protrude more in a direction in which it gets apart from the corresponding side surface of the component main body than the other lead terminals. Accordingly, it is possible to prevent deformation of the lead terminal.