Lead Terminal Stress Relief Shape for Semiconductor Reliability
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Solution Overview
Problem
The existing power semiconductor module structures face issues with lead terminal deformation under stress, leading to malfunctions due to increased complexity and stress resistance, which cannot be effectively addressed by existing techniques.
Innovation Solution
A semiconductor device with a conductive portion on a substrate, housed in a case with a lead terminal integrated directly to the semiconductor element or substrate, featuring a stress relief shape to mitigate stress-induced malfunctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the lead terminal is directly connected to the semiconductor element to simplify the structure, then the device complexity is reduced, but the lead terminal becomes more susceptible to stress and deformation
Solution Approach 1:
The lead terminal is divided into multiple sections with different functions: a connection section for electrical connection, a stress relief section for absorbing stress, and an external connection section for external wiring. This segmentation allows each part to optimize its function while maintaining overall structural simplicity.
Solution Approach 2:
The stress relief section acts as an intermediary element between the rigid semiconductor element connection and the flexible external wiring. This intermediary section absorbs and relieves stress, preventing direct transmission of mechanical stress to the critical connection point.
2Stability of the object's composition
If the lead terminal is made rigid to maintain structural stability, then the structural stability is improved, but the lead terminal cannot relieve stress and may deform under stress
Solution Approach 1:
The lead terminal transitions from a static rigid structure to a dynamic structure with a stress relief section that can deform elastically. This dynamic section absorbs mechanical stress through controlled deformation, protecting the rigid connection section while maintaining overall structural stability.
Solution Approach 2:
The cross-sectional area of the lead terminal is varied along its length, with the stress relief section having a smaller cross-sectional area than the connection section. This parameter change creates a flexible region that can relieve stress while maintaining structural integrity in critical areas.
3Reliability
If multiple components are used to ensure lead terminal functionality, then the reliability is improved, but the device complexity and number of components increase
Solution Approach 1:
The lead terminal integrates multiple functions into a single component: electrical connection, stress relief, and external connection. This merging eliminates the need for separate internal lead terminals, relay sections, and external lead terminals, reducing the total component count while maintaining reliability.
Solution Approach 2:
The integrated lead terminal serves multiple purposes simultaneously: it provides electrical connection to the semiconductor element, relieves mechanical stress through its flexible section, and offers external connection points for wiring. This multi-functionality reduces the need for specialized components.
Data Source
AI summary
A semiconductor device includes a conductive portion having semiconductor elements provided on a substrate, a case housing the conductive portion, and a lead terminal integrated into the case to be directly connected to the semiconductor elements or an interconnection of the substrate. The lead terminal has a stress relief shape for reliving stress generated in the lead terminal.