Lead Terminals Crossing Sealed Space in Laser Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor laser light source devices face reliability issues due to heat not being effectively transferred from the metal film to the resin portion of the package, leading to potential resin decomposition and increased costs from separate shielding components.
Innovation Solution
A light source device design featuring a base with a metal bottom portion for heat dissipation, a resin peripheral wall with a translucent portion on the optical axis, and lead terminals that cross the sealed space to shield the resin from direct laser exposure, eliminating the need for a separate heat-resistant resin and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate shielding plate is provided between the package peripheral wall and the lid, then the resin portion is protected from heat and beam damage, but the device complexity and manufacturing cost increase
Solution Approach 1:
The lead terminals are configured to cross the sealed space and extend through the peripheral wall portion, serving dual functions as both electrical connection elements and shielding structures. This merging of functions eliminates the need for separate shielding plates while maintaining protection of the resin portion from direct beam exposure and heat damage.
Solution Approach 2:
The lead terminals perform multiple roles: providing electrical connection to the semiconductor laser, conducting heat away from the active region, and acting as shielding structures that block direct beam exposure to the resin peripheral wall. This multi-functionality reduces the total number of components required in the device.
2Reliability
If the metal film absorbs all heat from the laser beam, then the resin portion is protected from thermal damage, but the device cannot dissipate excess heat effectively
Solution Approach 1:
The lead terminals serve as intermediary heat transfer paths between the semiconductor laser and the external environment. They conduct heat away from the laser active region through their metallic structure, providing an additional heat dissipation pathway that complements the metal film's thermal management function.
Solution Approach 2:
The lead terminals are positioned strategically to provide localized heat dissipation and shielding exactly where needed - in the sealed space surrounding the semiconductor laser. This localized approach allows the metal film to handle general heat distribution while the lead terminals address specific hot spots and beam exposure areas.
3Productivity
If the translucent portion is positioned on the optical axis to transmit the beam, then the beam transmission efficiency is maximized, but the resin portion is exposed to direct beam exposure and heat damage
Solution Approach 1:
The light transmission path is segmented into different zones: the translucent portion on the optical axis allows efficient beam transmission, while the lead terminals create shielded zones around the resin peripheral wall. This segmentation allows simultaneous optimization of beam transmission efficiency and resin protection by dividing the internal space into functional regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances reliability by preventing resin degradation and reduces manufacturing costs through integrated components, effectively managing heat and beam reflection within the device.
Implementation Method 1
a base (4) including a bottom portion (6) and a peripheral wall portion (8), a semiconductor laser (10) placed on an upper surface (6A) of the bottom portion (6)
Implementation Method 2
a translucent portion (14) provided in the peripheral wall portion (8) or the cap (12), the translucent portion (14) configured to transmit a beam emitted from the semiconductor laser (10)
Implementation Method 3
two lead terminals (16A, 16B) configured to cross the sealed space (A) from one inner surface (8A) to the other inner surface (8B) of the peripheral wall portion (8)
Data Source
AI summary
A light source device includes: a base comprising a bottom portion and a peripheral wall portion; a semiconductor laser located on the bottom portion; a cap connected to an upper surface of the peripheral wall portion, wherein the cap and the base define a sealed space; a translucent portion located in the peripheral wall portion or the cap, the translucent portion being configured to transmit a beam emitted from the semiconductor laser; and first and second lead terminals located in the sealed space and crossing from a first inner surface of the peripheral wall portion to a second inner surface of the peripheral wall portion. The semiconductor laser is located between the two lead terminals. The translucent portion is located on an optical axis of the beam emitted from the semiconductor laser.