Semiconductor Lead Wire Bridge Structure for Stable Resin Sealing
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Solution Overview
Problem
Conventional semiconductor devices with vertically drawn wiring connections face challenges in resin sealing, as the wiring is difficult to support, leading to potential collapse and process failures due to increased parasitic inductance and size constraints.
Innovation Solution
The semiconductor device employs a bridge wiring configuration with inclined standing portions that connect the connection targets and are sealed with resin, allowing for exposure of top portions to face each other, which are then divided to form lead wires, providing multi-point support and preventing collapse during resin sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertically drawn wiring connections are used, then parasitic inductance increases and device size increases, but wiring stability during resin sealing deteriorates leading to collapse and process failures
Solution Approach 1:
The wiring is divided into multiple segments: a connection portion connected to the connection target, a standing portion inclined at 45-60 degrees, and a top portion exposed from the sealing resin. This segmentation allows each part to perform its specific function - the connection portion provides stable attachment, the standing portion provides structural support and reduces inductance, and the top portion enables external connection
Solution Approach 2:
The wiring transitions from a conventional vertical configuration to a three-dimensional structure with inclined standing portions. The wiring extends in multiple spatial dimensions rather than purely vertically, allowing it to bridge connection targets while maintaining stability during resin sealing and reducing parasitic inductance
2Manufacturing precision
If bridge wiring with inclined standing portions is used, then wiring collapse during resin sealing is suppressed, but manufacturing process complexity increases
Solution Approach 1:
The bridge wiring with inclined standing portions is formed before resin sealing, establishing the wiring structure in advance. The standing portions are pre-configured at specific angles (45-60 degrees) to provide optimal support during the subsequent resin sealing process, preventing collapse before it can occur
Solution Approach 2:
The wiring geometry parameters are optimized - the standing portion angle is set between 45-60 degrees, and the wiring material properties are selected to achieve the right balance between flexibility for forming and rigidity for support. These parameter changes enable the wiring to maintain its shape during resin sealing while remaining manufacturable
Data Source
AI summary
A semiconductor device includes a first lead wire connected to a first connection target; a second lead wire connected to a second connection target; and a sealing resin that seals the first connection target, the second connection target, the first lead wire, and the second lead wire. The first lead wire includes a first connection portion connected to the first connection target, a first top portion exposed from the sealing resin, and a first standing portion connecting the first connection portion and the first top portion. The second lead wire includes a second connection portion connected to the second connection target, a second top portion exposed from the sealing resin, and a second standing portion connecting the second connection portion and the second top portion. The first top portion and the second top portion are disposed to face each other.