Leaded Component Insertion Using Sequential Through-Hole Alignment
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Solution Overview
Problem
Existing technologies struggle to reliably insert multiple leads into through-holes of a board, particularly when leads are bent or curved, leading to discarded components and increased tact time due to lead correction.
Innovation Solution
A board work machine and insertion method that prioritize inserting leads based on proximity to the board, with longer leads inserted first, using imaging data to align leads with through-holes accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a substrate working machine is tilted during insertion, then insertion flexibility is improved, but precision positioning deteriorates due to gravity affecting the substrate holder
Solution Approach 1:
The patent applies counterweight by tilting the substrate holder in the opposite direction to gravity's effect. The holder is inclined at a specific angle (e.g., 5-15 degrees) to compensate for gravitational pull, ensuring that substrates remain properly positioned during insertion even when the machine is tilted for accessibility. This counteracts gravity's destabilizing effect and maintains positioning precision.
Solution Approach 2:
The substrate holder is designed with dynamic adjustment capability, allowing the tilt angle to be optimized based on insertion requirements. The holder can be adjusted to different inclination angles to balance between insertion flexibility and positioning precision, adapting to different working conditions and substrate types.
2Ease of operation
If the substrate holder is tilted to improve insertion accessibility, then operator access is improved, but substrate positioning accuracy deteriorates due to gravitational effects
Solution Approach 1:
The substrate holder incorporates a counterbalanced tilt mechanism that compensates for gravity's effect on substrate positioning. By tilting the holder at a controlled angle opposite to the insertion direction, the system improves operator accessibility while maintaining positioning accuracy through gravitational counteraction.
Solution Approach 2:
The tilted substrate holder acts as an intermediary element between the vertical machine structure and the horizontal insertion path. It mediates the conflict between accessibility requirements and positioning precision by providing an inclined surface that facilitates easier insertion while gravity counteracts to maintain accuracy.
3Productivity
If substrates are held vertically during insertion, then gravity assistance for insertion is improved, but precision positioning deteriorates due to unstable holder orientation
Solution Approach 1:
The substrate holder employs dynamic tilt adjustment during the insertion process. Initially, substrates are held vertically to utilize gravity for fast insertion, then the holder tilts to a precise angle during positioning to ensure accuracy. This dynamic transition between vertical and tilted states optimizes both insertion speed and positioning precision.
Solution Approach 2:
The insertion process uses periodic action by alternating between vertical holding (for gravity-assisted insertion) and tilted positioning (for precision placement). The holder periodically transitions between these two states, utilizing gravity during insertion phases while maintaining precision during positioning phases.
Data Source
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AI summary
In a component mounter provided with a holding tool configured to hold leaded component 93, a moving device configured to move the holding tool, and an imaging device configured to image a leaded component held by the holding tool, the lengths of the pair of leads 95 of leaded component 93 are different. With respect to this, operation of the moving devices is controlled based on imaging data of the leaded component captured by the imaging device, and the tip section of long lead 95a of the pair of leads of the leaded component held by the holding tool is inserted in a through-hole 200. Next, leaded component 93 is moved such that short lead 95b is positioned above a through-hole 200, and the short lead is inserted into the through-hole. That is, the pair of leads are inserted into the through-holes in order of proximity of the tips to circuit board 12, closer leads being inserted earlier. Thus, even if leads are bent or the like, multiple leads can be appropriately inserted in order into the through-holes.