Leadframe Battery Attachment for Flexible Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor devices often face constraints in accommodating flexible and less constrained applications while maintaining low production costs, particularly in manufacturing processes that affect their functionality and efficiency.
Innovation Solution
The integration of a package leadframe with a first and second battery lead, forming an integrated battery holder, where the battery leads are connected to the battery terminals through bond wires, allowing for various battery sizes, shapes, and configurations, and supplying operating voltage and current for self-sustained operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor devices are produced in high volumes with optimized manufacturing processes, then product costs are reduced, but flexibility and adaptability for various applications are constrained
Solution Approach 1:
The leadframe is designed with multiple functional regions that can serve different purposes: a die pad region for mounting semiconductor dies, and exposed portions configured as battery holders for mounting batteries. This multi-functional design allows the same manufacturing process and leadframe structure to support both traditional semiconductor device applications and battery-powered applications, thereby improving adaptability without compromising manufacturing efficiency or cost-effectiveness
2Adaptability or versatility
If a battery holder is integrated into the leadframe, then adaptability to various battery configurations is improved, but device complexity increases
Solution Approach 1:
The battery holder functionality is merged directly into the leadframe structure by configuring exposed portions of the leadframe as battery holders. This integration eliminates the need for separate battery holder components, reducing overall device complexity while maintaining adaptability to various battery sizes and configurations. The leadframe simultaneously serves as both the electrical connection structure and the mechanical mounting structure for batteries
Data Source
AI summary
A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.