Leadframe Chip Carrier Layout Without Diepads for Lower Parasitics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices using diepads face design constraints, input/output parasitic effects, and vibration risks, which limit their performance and reliability.
Innovation Solution
A semiconductor device design featuring a single row of leads with a chip carrier comprising an electrically insulating layer, where semiconductor chips are mounted exclusively over this row, eliminating the need for diepads and allowing for improved mechanical support and reduced vibration risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If diepads are used to mount semiconductor chips, then mechanical support is provided, but design constraints and vibration risks increase
Solution Approach 1:
The patent removes the diepad structure from the semiconductor device, mounting chips directly on the leadframe leads. This extraction eliminates the interface between diepad and leads that causes vibration, while still providing mechanical support through the leads themselves.
Solution Approach 2:
The device is segmented into discrete components (chips, leads, encapsulant) where chips are mounted directly on individual leads or lead groups rather than on a consolidated diepad structure, reducing vibration transmission paths.
2Ease of manufacture
If diepads are used to mount semiconductor chips, then chip mounting is enabled, but input/output parasitic effects increase
Solution Approach 1:
The diepad structure is removed entirely, eliminating the parasitic inductance and resistance associated with diepad-lead connections. Chips are mounted directly on leads, shortening current paths and reducing parasitic effects.
Solution Approach 2:
The mounting approach transitions from a planar diepad surface to a linear lead-based mounting structure, changing the dimensional arrangement of electrical connections to reduce parasitic loop areas.
3Strength
If diepads are used for chip mounting, then design flexibility is reduced, but mechanical support is provided
Solution Approach 1:
By removing the diepad constraint, the patent enables greater design flexibility in chip placement and lead configuration, while the leadframe structure itself provides the necessary mechanical support.
Solution Approach 2:
The leads serve multiple functions: providing electrical connections, mechanical support for chips, and structural framework for the entire device, eliminating the need for separate diepad structures.
Data Source
AI summary
A semiconductor device and method is disclosed. In one example, the semiconductor device includes a single first row of leads and a first chip carrier comprising a first electrically insulating layer arranged on the single first row of leads. At least one first semiconductor chip is mounted on the first electrically insulating layer, wherein the at least one first semiconductor chip is arranged over only the single first row of leads.