Semiconductor Leadframe Connector Bonding Alignment

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Solution Overview

Problem

In semiconductor device manufacturing, there is a challenge in preventing the first and second conductive members from approaching each other during the bonding process, which can lead to electrical short-circuiting of the semiconductor chip's terminals.

Innovation Solution

A method where a single connector member is used to bond both conductive parts to the semiconductor chip's terminals and leadframes, forming a continuous body that prevents misalignment and separation, even under conditions like reflow where solder melts and flows, using a specific leadframe design with extensions that engage the connector member to maintain proper positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If two separate conductive members are used to bond terminals to leadframes, then the bonding process is simpler, but the conductive members may approach each other causing electrical short-circuiting

Engineering Contradiction:

Improvebonding process simplicityVSAvoidelectrical insulation between conductive members

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent combines two separate conductive members into a single connector member that has first and second conductive parts integrated into one continuous structure. This merging eliminates the risk of the conductive members approaching each other and causing short-circuits, while still allowing simultaneous bonding to both terminals through the integrated connector member

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The connector member is segmented into distinct first and second conductive parts that are electrically isolated from each other by the sealing member. Each conductive part can be independently positioned and bonded to its corresponding terminal, maintaining the functional separation needed for electrical insulation while being part of a single continuous structure

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If conductive members are positioned close to each other to reduce device size, then the device becomes more compact, but the risk of electrical short-circuiting increases

Engineering Contradiction:

Improvedevice sizeVSAvoidelectrical insulation

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The sealing member acts as an intermediary substance that is filled in the space between the first and second conductive parts. This intermediary provides electrical insulation while allowing the conductive parts to be positioned close together for compact device design, preventing short-circuits even when the conductive parts are in close proximity

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a single connector member is used to bond both conductive parts, then misalignment and short-circuiting are prevented, but the manufacturing complexity increases

Engineering Contradiction:

Improvealignment accuracy of conductive membersVSAvoidconnector member structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The single connector member serves multiple functions: it provides both the first and second conductive parts for electrical connection, acts as a structural framework for positioning, and enables simultaneous bonding operations. This multi-functionality maintains alignment accuracy while the added complexity is offset by the elimination of separate conductive member handling

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents electrical short-circuiting by maintaining the separation of conductive parts and ensuring accurate alignment during the bonding process, enhancing the reliability of the semiconductor device.

Implementation Method 1

even under conditions like reflow where solder melts and flows

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentUS11367675B2Method for manufacturing semiconductor device including a semiconductor chip and lead frame

Publication Date: 2022.06.21 KK TOSHIBA

AI summary

A method for manufacturing a semiconductor device includes: fixing a semiconductor chip to a first part of a leadframe; bonding one connector member to a first terminal of the semiconductor chip, a second terminal of the semiconductor chip, a second part of the leadframe, and a third part of the leadframe; forming a sealing member; and separating a first conductive part of the connector member and a second conductive part of the connector member by removing at least a section of the portion of the connector member exposed outside the sealing member, the first conductive part being bonded to the first terminal and the second part, the second conductive part being bonded to the second terminal and the third part.