Leadframe-Cooled Power Module Layout for Compact Heat Dissipation
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Solution Overview
Problem
Conventional power electronic devices face thermal and energetic inefficiencies, particularly at peak loads, leading to insufficient heat dissipation, increased installation space requirements, and parasitic inductance issues, which affect signal quality and power density.
Innovation Solution
A power electronic device design featuring a leadframe connected to a power semiconductor for heat transfer, housed within a liquid reservoir with a cooling liquid, and a condensation unit for evaporated coolant, enabling efficient heat dissipation and low parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems with heat sinks are used for power semiconductors, then heat dissipation is achieved, but installation space requirements increase significantly
Solution Approach 1:
The patent merges the power semiconductor module with the cooling system into a single integrated unit. The housing contains both the power electronic components and the cooling liquid reservoir, eliminating the need for separate heat sinks and reducing installation space while maintaining effective heat dissipation through direct thermal coupling with the cooling liquid.
Solution Approach 2:
The patent uses a liquid cooling system where cooling liquid circulates through channels in the housing to absorb heat from power semiconductors. This hydraulic cooling approach provides superior heat dissipation efficiency in a compact form factor compared to conventional air-cooled heat sinks.
2Temperature
If larger heat transfer surfaces are used to improve cooling at peak loads, then heat dissipation performance increases, but power density decreases
Solution Approach 1:
The patent implements localized cooling channels and thermal management structures positioned directly at heat-generating points within the power semiconductor module. This targeted approach provides efficient peak load cooling without requiring overall system expansion, thereby maintaining high power density.
3Ease of manufacture
If conventional mounting arrangements are used, then assembly is simple, but parasitic inductance increases affecting signal quality
Solution Approach 1:
The patent adopts a three-dimensional integrated layout where power semiconductors, cooling channels, and electrical connections are arranged in multiple layers and dimensions within the housing. This spatial optimization reduces current loop areas and parasitic inductance while maintaining manufacturing feasibility through modular assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design optimizes thermal and energetic performance, allowing high-power operation with reduced installation space and minimal parasitic inductance, while maintaining efficient heat dissipation and scalability.
Implementation Method 1
heat can be transferred from the power semiconductor to the leadframe and conducted away from the power semiconductor by the leadframe
Implementation Method 2
a condensation unit for evaporated coolant
Data Source
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AI summary
The invention relates to a power electronics device and a power electronics functional system. The power electronics device (1) comprises at least one power semiconductor (16) and a first circuit board (30) controllingly connected to the power semiconductor (16), wherein the power electronics device (1) also comprises at least one lead frame (20), which forms the controlling connection between the power semiconductor (16) and the first circuit board (30), wherein the power semiconductor (16) is connected to at least one contacting region (21) of the lead frame (20) in such a way that heat can be transferred from the power semiconductor (16) to the lead frame (20) and can be carried away from the lead frame (20) by the power semiconductor (16), wherein the power electronics device (1) also comprises a housing (40), which borders at least regions of a fluid reservoir (41), in which a coolant fluid (42) is/can be accommodated, wherein a respective power semiconductor (16) and a respective lead frame (20) are arranged in the fluid reservoir (41) for the purpose of transferring heat from the respective power semiconductor (16) and/or from the respective lead frame (20) to the coolant fluid (42). The power electronics device and the power electronics functional system allow for a cooling of a power semiconductor in a thermally optimised and energy-optimised manner.