Semiconductor Leadframe Assembly for Precise Electrode Placement
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Solution Overview
Problem
Existing semiconductor devices using nitride semiconductors face challenges in precisely placing conducting members, such as source and drain electrodes, which affects the device's performance and reliability.
Innovation Solution
A method for manufacturing semiconductor devices involves preparing leadframes with specific configurations and using conductive pastes to bond the semiconductor elements, ensuring precise placement of electrodes through a curing process, resulting in a semiconductor device with improved electrode alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used to attach conducting members to electrodes, then the manufacturing process is simple, but the placement precision of conducting members deteriorates
Solution Approach 1:
The leadframe is prepared in advance with pre-formed recesses that correspond to the positions of the electrodes. The conducting members are placed into these pre-prepared recesses before bonding, ensuring precise positioning. This preliminary preparation of the leadframe structure enables accurate placement without requiring complex real-time positioning systems during the bonding process.
2Reliability
If conducting members are precisely placed relative to each other, then device performance improves, but the manufacturing complexity increases
Solution Approach 1:
The recesses in the leadframe serve as an intermediary structure that mediates between the conducting members and the electrodes. These recesses physically guide and constrain the conducting members to their correct positions, acting as a mechanical intermediary that ensures precise relative placement without requiring complex alignment systems or multiple adjustment steps.
3Reliability
If multiple conductive pastes are used for bonding different components, then bonding reliability improves, but the curing process becomes more complex
Solution Approach 1:
The invention uses conductive pastes with different paste amounts for different bonding requirements. Specifically, a first conductive paste is applied in a first amount for bonding the semiconductor element to the leadframe, while second and third conductive pastes are applied in a second amount for bonding conducting members to electrodes. This parameter change in paste amount optimizes bonding reliability for each interface while maintaining a manageable curing process through systematic application procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables more precise placement of conducting members, enhancing the semiconductor device's performance and reliability by ensuring accurate electrical connections and compact device design.
Implementation Method 1
a first conductive paste interposed between the element reverse surface and the island part
Implementation Method 2
a second conductive paste interposed between the first part and the at least one first electrode and with a third conductive paste interposed between the second part and the at least one second electrode
Implementation Method 3
a curing step of curing the first conductive paste, the second conductive paste and the third conductive paste
Data Source
AI summary
A semiconductor device manufacturing method includes a first preparation step, a second preparation step, a mounting step, a third preparation step, a placing step and a curing step. In the first preparation step, a first leadframe including an island part is prepared. In the second preparation step, a semiconductor element including an element obverse surface, an element reverse surface, a first electrode and a second electrode is prepared. In the mounting step, the semiconductor element is mounted on the island part with a first conductive paste interposed between the element reverse surface and the island part. In the third preparation step, a second leadframe including a first part, a second part, a frame part, a first connecting part and a second connecting part is prepared. In the placing step, the second leadframe is placed with a second conductive paste interposed between the first part and the first electrode and with a third conductive paste interposed between the second part and the second electrode. In the curing step, the first conductive paste, the second conductive paste and the third conductive paste are hardened.