Leadframe-Embedded Electronic Packaging for Compact Reliability
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Solution Overview
Problem
Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and relatively low performance with large package sizes.
Innovation Solution
The proposed electronic device design includes a substrate structure with a base and a flag, coupled with electronic components through conductive bonds and interconnects, encapsulated by a molding compound, allowing for efficient heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic packages are used, then manufacturing processes are simpler, but package size is too large and performance is low
Solution Approach 1:
The patent implements nesting by placing the electronic component (e.g., LED die) directly within the cavity formed by the leadframe structure, and embedding the entire assembly within the molding compound. The leadframe itself is nested within the molded package body, creating a compact hierarchical arrangement that reduces overall package volume while maintaining structural integrity and electrical connectivity.
Solution Approach 2:
The patent transitions from traditional two-dimensional planar packaging to three-dimensional vertical stacking by positioning the electronic component upright within the leadframe cavity, with electrical connections extending vertically through the structure. This dimensional change allows more efficient use of space and enables smaller package footprints while maintaining all necessary electrical pathways.
2Reliability
If conventional electronic packages are used, then manufacturing methods are traditional, but reliability is decreased and cost is excessive
Solution Approach 1:
The patent applies preliminary action by pre-forming the leadframe with integrated electrical pathways, bonding pads, and structural supports before the electronic component is mounted. The leadframe is prepared in advance with precise geometric features and electrical connections, enabling faster and more reliable assembly of the final package while maintaining high manufacturing efficiency.
Solution Approach 2:
The patent merges multiple functions into the leadframe structure itself, which simultaneously provides mechanical support, electrical connectivity, thermal management pathways, and structural definition for the molding process. This consolidation of functions into a single integrated component reduces the number of separate parts and assembly steps, improving both reliability and manufacturing efficiency.
Data Source
AI summary
In one example, an electronic device comprises a substrate structure, comprising a base comprising a top side and a bottom side, a first lead, and a flag comprising a top side, a bottom side, and a flag lead. The electronic device also comprises an electronic component comprising a top side and a bottom side, a first electrode at the bottom side of the electronic component, and second electrode at the top side of the electronic component, an encapsulant contacting a lateral side of the electronic component and a lateral side of the base, and a first interconnect in the encapsulant, coupled between the first electrode and the first lead. The second electrode is coupled with the flag lead via the base. Other examples and related methods are also disclosed herein.