Leadframe Gaps and Electroplating for Planar Semiconductor Packages
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Solution Overview
Problem
The complexity and cost of manufacturing semiconductor packages are increased by the numerous method acts required, necessitating a more efficient approach to reduce the number of steps while maintaining effective encapsulation and electrical connectivity.
Innovation Solution
A method involving a leadframe strip with physically separated leads and a diepad, encapsulation with gaps to expose leads, and electroplating for metal coating, which simplifies the manufacturing process by eliminating the need for additional steps like mounting and demounting, thereby reducing production costs and ensuring a planar bottom surface without grooves or trenches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple method acts are performed to encapsulate and process semiconductor components, then encapsulation quality and electrical connectivity are improved, but manufacturing complexity and costs increase
Solution Approach 1:
The leadframe is designed with pre-formed gaps between leads and diepad before encapsulation. This preliminary structural configuration eliminates the need for subsequent groove formation steps, reducing manufacturing complexity while maintaining the encapsulation quality achieved through traditional multi-step processes
2Reliability
If traditional encapsulation methods are used without gaps, then complete encapsulation is achieved, but additional steps for groove formation and mounting/demounting are required
Solution Approach 1:
The leadframe structure is segmented with intentional gaps between leads and diepad. These segmented gaps serve dual purposes: they eliminate the need for post-encapsulation groove formation and provide direct exposure pathways for electrical connectivity, thereby improving manufacturing efficiency without compromising encapsulation completeness
Solution Approach 2:
The gaps are pre-formed in the leadframe structure before encapsulation occurs. This preliminary configuration of exposure pathways eliminates the need for subsequent groove formation and mounting/demounting operations, directly improving manufacturing efficiency while maintaining complete encapsulation of semiconductor components
3Reliability
If leads are physically connected to diepad without gaps, then electrical connectivity is ensured, but additional manufacturing steps are needed to create exposure pathways
Solution Approach 1:
The physical connection between leads and diepad is segmented by introducing gaps. These gaps maintain electrical connectivity through the encapsulation material while simultaneously serving as pre-formed exposure pathways, eliminating the need for additional groove formation steps and simplifying the manufacturing process
4Productivity
If conventional encapsulation without pre-formed gaps is used, then manufacturing steps are reduced, but grooves or trenches are created on the bottom surface
Solution Approach 1:
The leadframe is provided with gaps between leads and diepad before encapsulation. These pre-formed gaps serve as exposure pathways that eliminate the need for subsequent groove formation, thereby maintaining manufacturing efficiency while achieving a planar bottom surface without grooves or trenches
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in cost-efficient semiconductor packages with exposed leads for improved electrical connectivity and a planar bottom surface, enhancing the manufacturing efficiency and reducing production complexity.
Implementation Method 1
forming a metal coating on the exposed leads based on an electroplating process
Data Source
AI summary
A semiconductor package includes a leadframe including a diepad and a first row of leads, wherein at least one lead of the first row of leads is physically separated from the diepad by a gap. The semiconductor package further includes a semiconductor component arranged on the leadframe. The semiconductor package further includes an encapsulation material encapsulating the leadframe and the semiconductor component, wherein the encapsulation material includes a bottom surface arranged at a bottom surface of the semiconductor package, a top surface and a side surface extending from the bottom surface to the top surface. A side surface of at least one lead of the first row of leads is flush with the side surface of the encapsulation material. The flush side surface of the at least one lead is covered by an electroplated metal coating.