Leadframe Heatsink Positioning Portions Warping
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Solution Overview
Problem
Conventional leadframe packages with heatsinks suffer from unbalanced forces due to the absence of positioning portions, leading to warping of the leadframe.
Innovation Solution
Incorporating first and second heatsinks with positioning portions, such as stair-shaped or protrusion-slot configurations, to balance forces and prevent short circuits while enhancing heat dissipation by using encapsulating material and heat conducting materials between the heatsinks and the leadframe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If positioning portions are not provided on heatsinks, then the structure is simpler and easier to manufacture, but the leadframe experiences unbalanced forces causing warping
Solution Approach 1:
The heatsink is segmented by adding positioning portions (protrusions or slots) that divide the heatsink structure into functional zones: positioning zones for alignment and stabilization, and heat dissipation zones for thermal management. This segmentation allows the heatsink to simultaneously provide mechanical stability through positioning portions and thermal performance through heat dissipation structures.
2Stability of the object's composition
If positioning portions are added to heatsinks, then leadframe warping is prevented through balanced forces, but the device complexity increases
Solution Approach 1:
The positioning portions are designed with asymmetric configurations where protrusions on one heatsink correspond to slots on the other heatsink. This asymmetric design provides effective positioning and force balance while maintaining manufacturing simplicity through standardized forming processes for protrusions and slots.
3Manufacturing precision
If positioning portions are added to heatsinks, then positioning precision is improved to prevent short circuits, but the manufacturing process becomes more complex
Solution Approach 1:
The positioning portions (protrusions and slots) are pre-formed on the heatsinks before final assembly. This preliminary action ensures that when the heatsinks are mounted on the leadframe, the positioning portions automatically guide correct alignment and positioning, achieving high positioning precision without requiring complex real-time adjustment mechanisms during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses leadframe warping by providing balanced forces and efficient heat dissipation, preventing short circuits and improving the structural integrity of the package.
Implementation Method 1
heat conducting materials between the heatsinks and the leadframe
Implementation Method 2
enhancing heat dissipation by using encapsulating material and heat conducting materials between the heatsinks and the leadframe
Data Source
AI summary
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.