Leadframe Heat Dissipation in IC Packages
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Solution Overview
Problem
Thick die attach film (DAF) insulation layers in integrated circuit (IC) packages prevent heat generated by hot ICs from dissipating to the substrate, leading to increased thermal resistance between ICs and reduced heat dissipation efficiency.
Innovation Solution
A metal leadframe is disposed on the IC to conduct heat generated by the IC to a package substrate, acting as both an electrical conductor and a heat spreader, while also providing mechanical support for stacked ICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick die attach film (DAF) insulation layers are used to increase thermal resistance between hot ICs and adjacent ICs, then thermal isolation between ICs is improved, but heat dissipation from IC to substrate is prevented
Solution Approach 1:
The patent segments the thermal management function by introducing a dedicated thermal via structure that separates the thermal isolation function (handled by DAF between ICs) from the heat dissipation function (handled by thermal vias to substrate). This allows simultaneous achievement of both thermal isolation and heat dissipation.
Solution Approach 2:
The patent introduces thermal vias as an intermediary element between the IC and substrate. These vias act as a mediator that conducts heat away from the IC to the substrate without compromising the thermal isolation provided by the DAF layer, thus resolving the contradiction between isolation and dissipation.
2Reliability
If DAF insulation layers are used to prevent direct thermal conduction between ICs, then thermal resistance between ICs is increased, but heat generated by IC cannot dissipate to substrate
Solution Approach 1:
The patent divides the thermal management into two separate pathways: one for thermal isolation (maintained by DAF) and one for heat dissipation (achieved through thermal vias). This segmentation allows the system to prevent unwanted thermal conduction while maintaining efficient heat dissipation.
Solution Approach 2:
Thermal vias serve as an intermediary mechanism that provides an alternative heat dissipation route bypassing the DAF insulation layer. This mediator enables heat to escape to the substrate without being blocked by the insulation layer that prevents IC-to-IC thermal conduction.
3Volume of moving object
If higher density IC packaging is implemented to reduce system size, then electronic system size is reduced, but thermal output and heat dissipation challenges increase
Solution Approach 1:
The patent implements segmented thermal management with dedicated thermal vias distributed across the substrate, allowing heat from multiple high-density ICs to be dissipated through separate, controlled pathways. This prevents heat accumulation while maintaining compact packaging.
Solution Approach 2:
Thermal vias act as intermediary heat conduction elements that bridge the gap between densely packed ICs and the substrate. These mediators provide efficient heat transfer routes that enable high-density packaging without compromising thermal management capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The leadframe effectively dissipates heat from the IC to the substrate, preventing heat buildup between adjacent ICs and enhancing thermal management in high-density electronic systems.
Implementation Method 1
A metal leadframe may be disposed on the IC to conduct heat generated by the IC to a package substrate
Data Source
AI summary
Embodiments include apparatuses, methods, and systems that may include a leadframe of a circuit package to conduct heat generated by an integrated circuit (IC) included in the circuit package, while being a part of an interconnect of the circuit package. In various embodiments, a circuit package may include a package substrate, and an IC attached to the package substrate. A leadframe may be disposed on the IC to conduct heat generated by the IC. In addition, the leadframe may be a part of an interconnect of the circuit package, and the leadframe may be electrically coupled to a component of the IC. Other embodiments may be described and/or claimed.