Leadframe Joint Terminal Layout for Resin Flow and Peel Resistance
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Solution Overview
Problem
Existing semiconductor devices using lead frames face issues with residual stress and peeling at joint parts due to large areas of joint members, which can obstruct resin flow and cause voids or peeling between terminal portions and resin, leading to reduced yield and reliability.
Innovation Solution
The semiconductor device incorporates terminal portions that project towards each other, forming an opening to allow resin flow and reduce residual stress, thereby improving filling properties and reducing peeling between terminal portions and resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If joint members have large areas to ensure electrical connection, then electrical conductivity is improved, but residual stress and peeling occur at joint parts
Solution Approach 1:
The terminal portion is divided into multiple projecting portions (first projecting portion and second projecting portion) that are spaced apart. This segmentation distributes the electrical connection points, reducing stress concentration at any single joint location while maintaining overall electrical conductivity.
Solution Approach 2:
The terminal portion extends in a direction intersecting the resin flow direction, creating a three-dimensional structure with projecting portions at different positions. This spatial arrangement allows resin to flow between the projecting portions, reducing residual stress and preventing peeling while maintaining electrical connection reliability.
2Reliability
If terminal portions are positioned to ensure electrical connection, then electrical conductivity is improved, but resin flow is obstructed causing voids and peeling
Solution Approach 1:
The terminal portion is segmented into multiple projecting portions spaced apart from each other. This segmentation creates gaps that allow resin to flow through and around the terminal structure, ensuring complete filling without voids while maintaining electrical connection functionality.
Solution Approach 2:
The terminal portion is configured to extend in a direction intersecting the resin flow direction, with projecting portions positioned at different locations. This three-dimensional arrangement creates channels for resin flow, improving manufacturing precision by eliminating voids and peeling issues.
3Reliability
If joint members have large areas for electrical connection, then electrical conductivity is improved, but manufacturing efficiency decreases due to longer curing times
Solution Approach 1:
The terminal portion is divided into multiple smaller projecting portions rather than one large joint member. This segmentation reduces the total volume of material requiring curing, thereby reducing curing time and improving manufacturing efficiency while maintaining electrical connection reliability through multiple connection points.
Solution Approach 2:
The terminal portion extends in a direction intersecting the resin flow direction, creating a distributed three-dimensional structure. This configuration reduces the depth and volume of resin that needs to cure, shortening curing time and improving productivity while ensuring reliable electrical connections through multiple projecting portions.
Data Source
AI summary
According to one embodiment, a semiconductor device includes: a first frame; a first chip on the first frame; a second frame spaced apart from the first frame in a first direction; a second chip on the second frame; and a first joint terminal above the second chip. The first frame includes a first terminal portion extending toward the second frame. The first joint terminal includes a second terminal portion extending toward the first frame. The second terminal portion includes first and second projecting portions each of which projects toward the first frame and which are spaced apart from each other in a second direction. An end portion of the first projecting portion and an end portion of the second projecting portion are each joined on the first terminal portion.