Leadframe LED Tube Lamp Structure for Simpler Low-Material Assembly
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Solution Overview
Problem
The production of retrofit LED tube lamps using printed circuit boards and wiring boards is complex and costly, leading to environmental pollution and high material consumption.
Innovation Solution
A light fixture with a leadframe-based light engine, where semiconductor light elements are arranged on stamped or cut-out conductive structures without insulating substrates, using SMD soldering and potentially coated with reflective layers, and integrated with a gas-tight tubular bulb for improved heat dissipation and reduced gas emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If printed circuit boards are used for the light engine, then the LEDs can be mounted and connected, but the production becomes complex and costly with high copper consumption and environmental pollution
Solution Approach 1:
The patent extracts the copper layer from the printed circuit board substrate, using only the necessary conductive copper traces without the full PCB structure. This reduces material consumption and simplifies production while maintaining the essential function of electrical connection for LEDs.
Solution Approach 2:
The patent applies conductive copper structures only where needed for electrical connections, rather than using a complete printed circuit board. The copper is selectively placed to create conductive paths and connection points for LEDs, reducing overall material usage and production complexity.
2Reliability
If printed circuit boards are used for the light engine, then the LEDs can be mounted and connected, but material consumption and production costs increase
Solution Approach 1:
The patent extracts the copper layer from the printed circuit board substrate, using only the necessary conductive copper traces without the full PCB structure. This reduces material consumption and simplifies production while maintaining the essential function of electrical connection for LEDs.
Solution Approach 2:
The patent discards the non-essential parts of the printed circuit board (substrate and excess copper), keeping only the functional conductive traces needed for LED connections. This selective retention reduces material consumption and waste.
3Ease of manufacture
If wiring boards are used for the light engine, then production is simplified compared to printed circuit boards, but the production remains elaborate and expensive
Solution Approach 1:
The patent extracts the essential conductive function from complex wiring board structures, using simple stamped metal pieces with integrated conductive paths. This maintains ease of manufacture while eliminating the elaborate multi-layer construction of traditional wiring boards.
Solution Approach 2:
The patent merges the structural support function and electrical connection function into a single stamped metal component. The metal stamping serves both as the mechanical base for mounting LEDs and as the conductive path for electrical connections, eliminating the need for separate wiring board layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies production, reduces material costs, enhances thermal conductivity, and minimizes gas emissions, allowing for more flexible design and better light transmission while maintaining performance in demanding environments.
Implementation Method 1
The leadframe can be manufactured for example from a cost-effective material, such as for instance steel, or a material with high thermal conductivity, such as for instance copper
Implementation Method 2
The surfaces of the leadframe can also be coated with a good reflecting coating, for example with a white or bright color or lacquer layer
Implementation Method 3
the solder points on the stamped out sheet metal parts (conductive tracks) are provided with a soldering paste, then equipped with the semiconductor light elements and finally are heated by infrared radiation from a melting furnace, whereby the soldering paste melts
Implementation Method 4
heated by infrared radiation from a melting furnace, whereby the soldering paste melts
Data Source
AI summary
A light fixture has a translucent tubular bulb. At least one end cap is located at one end of the translucent tubular bulb. A light engine is disposed in the translucent tubular bulb. The light engine has a leadframe on which a plurality of semiconductor light elements is arranged. The fixture may include an electronic driver. The electronic driver includes a plurality of electronic components. At least one of the plurality of electronic components is arranged inside the transparent tubular bulb.