Leadframe-Less LDS Package Structure for Thinner Semiconductor Assembly
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Solution Overview
Problem
Conventional semiconductor packages are limited by the need for leadframes, which increase manufacturing lead time and restrict package thickness due to handling and shipping constraints, resulting in thicker packages and reduced production efficiency.
Innovation Solution
The use of laser direct structuring (LDS) to form leadframe-less semiconductor packages, where non-conductive metallic compounds are converted to conductive materials using a laser, eliminating the need for leadframes and allowing for thinner, more efficient package design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leadframes are used to form conventional semiconductor packages, then structural support and electrical connectivity are provided, but manufacturing lead time is increased and package thickness is limited from being reduced
Solution Approach 1:
The patent removes the leadframe component entirely from the semiconductor package structure. Instead of using a separate leadframe that requires external manufacturing and assembly, the invention integrates all necessary electrical interconnect functions directly into the substrate through laser direct structuring, thereby eliminating the time-consuming leadframe manufacturing and assembly process while maintaining structural support and electrical connectivity
Solution Approach 2:
The patent combines the functions of the leadframe (structural support and electrical interconnection) with the substrate by forming conductive structures directly within the substrate material. This merging eliminates the need for separate leadframe components and their associated manufacturing lead times, while the substrate itself provides both mechanical support and electrical pathways
2Stability of the object's composition
If leadframes are made thick enough to avoid deformation during handling, then structural stability is maintained, but overall package thickness increases
Solution Approach 1:
The patent employs thin conductive structures formed within the substrate that provide sufficient mechanical stability without requiring the thickness of traditional leadframes. These laser-formed conductive pathways are integrated into the substrate matrix, which provides the necessary structural support, allowing the package to be significantly thinner while maintaining stability during handling and shipping
Solution Approach 2:
The patent uses composite material structures where conductive materials are formed within the substrate material through laser direct structuring. This composite approach allows the substrate to provide both mechanical strength and electrical conductivity, eliminating the need for thick, separate leadframe structures and enabling thinner overall package design while maintaining structural stability
3Reliability
If electrical wires are formed to couple die to leads, then electrical connectivity is achieved, but clearance area is required that limits further thickness reduction
Solution Approach 1:
The patent merges the electrical interconnection function with the substrate by forming conductive structures directly within the substrate material using laser direct structuring. This integration eliminates the need for separate wire bonds and the clearance space they require, allowing the package thickness to be reduced while maintaining reliable electrical connectivity between die and external contacts
Solution Approach 2:
The patent removes the wire bonding process and associated clearance requirements from the package structure. By forming conductive pathways directly in the substrate, the invention eliminates the need for external wire connections and the space they occupy, enabling further thickness reduction while achieving the necessary electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing lead time and enables thinner semiconductor packages with improved production efficiency, as the LDS process eliminates the constraints associated with leadframe thickness and handling, allowing for more compact and efficient package design.
Implementation Method 1
laser direct structuring (LDS) to form a leadframe-less semiconductor package
Implementation Method 2
non-conductive metallic compounds are converted to conductive materials using a laser
Data Source
AI summary
The present disclosure is directed to a semiconductor package including a first laser direct structuring (LDS) resin layer and a second LDS resin layer on the first LDS resin layer. Respective surfaces of the first LDS resin layer and the second LDS resin layer are patterned utilizing an LDS process by exposing the respective surfaces to a laser. Patterning the first and second LDS resin layers, respectively, activates additive material present within the first and second LDS resin layers, respectively, converting the additive material from a non-conductive state to a conductive state. The LDS process is followed by a chemical plating step and an electrolytic plating process to form conductive structure coupled to a plurality of die within the first and second LDS resin layers. A molding compound layer is formed on surfaces of the conductive structures and covers the surfaces of the conductive structures. After these steps have been completed, the first LDS resin layer and the second LDS resin layer are singulated along channels filled with conductive material.