Leadframe-Less LDS Package Structure for Thinner Semiconductor Packaging
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Solution Overview
Problem
Conventional semiconductor packages rely on leadframes, which increase manufacturing lead time and limit package thickness due to handling and shipping constraints, restricting the overall thickness of the packages.
Innovation Solution
The use of laser direct structuring (LDS) to form leadframe-less semiconductor packages, where non-conductive metallic compounds are converted to conductive materials using a laser, eliminating the need for leadframes and allowing for thinner packages with reduced manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leadframes are used to form conventional semiconductor packages, then structural support and handling stability are provided, but manufacturing lead time is increased and package thickness is limited
Solution Approach 1:
The patent extracts and removes the leadframe component from the semiconductor package structure entirely. By eliminating the leadframe, the manufacturing process no longer requires separate leadframe fabrication and assembly steps, thereby reducing manufacturing lead time while maintaining package functionality through alternative support structures
Solution Approach 2:
The patent merges the leadframe's structural support function with the package substrate itself. The substrate is designed to provide both the mounting platform for semiconductor devices and the mechanical support previously provided by separate leadframes, integrating multiple functions into a single component
2Reliability
If leadframes are made thick enough to avoid deformation during handling, then handling stability is improved, but package thickness cannot be reduced
Solution Approach 1:
By removing the leadframe entirely, the patent eliminates the thickness constraint imposed by leadframe requirements. The package can now be designed with minimal thickness necessary for the semiconductor devices and interconnections, without being forced to accommodate thick leadframe structures
Solution Approach 2:
The patent employs thin-film technologies and flexible substrate materials that can provide adequate mechanical support at reduced thickness. These thin-film structures offer sufficient flexibility and strength for handling while enabling significantly thinner overall package profiles compared to rigid leadframe-based designs
3Reliability
If electrical wires are formed to couple die to leads, then electrical connections are established, but clearance area is required and package thickness is limited
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure itself. Conductive traces are integrated directly into the substrate, eliminating the need for separate wire bonds and the clearance space they require. This integration reduces the overall package thickness by consolidating multiple functions into the substrate layer
Solution Approach 2:
The patent replaces the mechanical wire bonding process with planar conductive traces formed through photolithography and metallization processes. This substitution eliminates the need for physical wire bonds and their associated clearance requirements, enabling thinner package designs with more efficient space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing lead time and enables thinner semiconductor packages by eliminating the thickness limitations imposed by leadframes, allowing for more compact and efficient packaging.
Implementation Method 1
a laser direct structuring (LDS) process is utilized to form conductive structures within an embodiment of a semiconductor package
Data Source
AI summary
The present disclosure is directed to a semiconductor package including a first laser direct structuring (LDS) resin layer and a second LDS resin layer on the first LDS resin layer. Respective surfaces of the first LDS resin layer and the second LDS resin layer are patterned utilizing an LDS process by exposing the respective surfaces to a laser. Patterning the first and second LDS resin layers, respectively, activates additive material present within the first and second LDS resin layers, respectively, converting the additive material from a non-conductive state to a conductive state. The LDS process is followed by a chemical plating step and an electrolytic plating process to form conductive structure coupled to a plurality of die within the first and second LDS resin layers. A molding compound layer is formed on surfaces of the conductive structures and covers the surfaces of the conductive structures. After these steps have been completed, the first LDS resin layer and the second LDS resin layer are singulated along channels filled with conductive material.