Leadframe-Reinforced Optoelectronic Package for Fracture Resistance
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Solution Overview
Problem
Surface mountable semiconductor components often experience fractures in their plastic housing due to mechanical stress during handling and transportation, which is not effectively addressed by existing technologies.
Innovation Solution
The semiconductor component incorporates a metallic lead frame unit with concealed metal tongues embedded within the plastic base body, providing mechanical reinforcement and increased stability by distributing pressure more evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a plastic base body is used for the semiconductor component, then the component is electrically insulating and easy to manufacture, but the base body is prone to fractures under mechanical stress during handling and transportation
Solution Approach 1:
The patent applies composite materials by embedding metallic lead frame parts with tongues inside the plastic base body. The lead frame parts consist of a metallic base material with integrated tongues that extend into the plastic housing. This composite structure combines the electrical insulation and manufacturing ease of plastic with the mechanical strength and fracture resistance of metal, directly resolving the contradiction between ease of manufacture and reliability.
2Ease of operation
If the lead frame parts are made flat and unbent, then the mounting plane is achieved for surface mounting, but the mechanical reinforcement against fractures is reduced
Solution Approach 1:
The patent applies dimensionality change by extending the lead frame tongues in the depth dimension (z-direction) into the plastic base body, rather than only in the planar directions. The tongues have a first extension direction parallel to the mounting plane and a second extension direction perpendicular to the mounting plane, creating a three-dimensional reinforcement structure that provides both surface mounting capability and internal mechanical strength.
3Strength
If metal tongues are embedded in the plastic base body, then mechanical reinforcement is provided to absorb greater forces, but the device complexity increases
Solution Approach 1:
The patent applies merging by integrating the lead frame functionality with the housing reinforcement functionality. The metallic lead frame parts are not separate reinforcement elements but are merged with the base body structure, with the tongues becoming part of the molded plastic housing. This integration provides both electrical connection and mechanical reinforcement without adding separate components, thereby reducing device complexity while maintaining strength.
Data Source
AI summary
In an embodiment a component includes a metallic first lead frame part, a metallic second lead frame part, an electrically insulating base body mechanically connecting the lead frame parts to one another and directly surrounding the lead frame parts and an optoelectronic semiconductor chip, wherein each of the lead frame parts has a component side and an opposite mounting side, wherein the semiconductor chip is attached to the component side of the first lead frame part, wherein the first lead frame part includes a plurality of tongues extending towards an edge of the base body and end inside the base body, wherein the tongues extend spaced from a mounting plane, wherein, when viewed in plan view of the component side, the first lead frame part has an angular basic shape, wherein a first distance between the tongues and outer side surfaces of the base body is at least 50 μm, and wherein a second distance between the basic shape and the outer side surfaces is at least twice as large as the first distance.