Leadframe Package with Identical Contact Patterns for Flexible Mounting
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Solution Overview
Problem
Leadframe-based packages are typically surface mounted in a horizontal orientation, which can be inefficient and cumbersome, especially for devices like accelerometers that require specific mounting orientations.
Innovation Solution
A leadframe package with non-parallel exterior surfaces having substantially electrically identical contact patterns, allowing for vertical or horizontal mounting, formed by a base and lid with moldable material and embedded contacts, enabling flexible orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a leadframe package is designed for horizontal mounting only, then the package structure is simple and manufacturing is straightforward, but the package lacks flexibility in mounting orientations
Solution Approach 1:
The package employs asymmetric contact patterns on different exterior surfaces, where the first contact pattern on the first exterior surface and the second contact pattern on the second exterior surface are configured to be substantially electrically identical despite being on different surfaces. This asymmetric design enables the package to be mounted in multiple orientations (horizontal or vertical) while maintaining proper electrical connectivity, thus improving adaptability without significantly increasing complexity
Solution Approach 2:
The package is designed with universal mounting capability by providing substantially electrically identical contact patterns on multiple exterior surfaces. This allows the same package design to serve multiple mounting functions (horizontal or vertical mounting) without requiring different package variants, thereby improving versatility while keeping the package structure relatively simple
2Ease of operation
If a leadframe package requires specific mounting orientation, then the electrical connection is optimized for that orientation, but the circuit board mounting becomes cumbersome and inefficient
Solution Approach 1:
The package provides universal mounting capability by configuring substantially electrically identical contact patterns on multiple exterior surfaces. This enables the package to be mounted in either horizontal or vertical orientations without compromising electrical connection quality, thereby improving ease of operation and mounting efficiency while eliminating orientation constraints
3Adaptability or versatility
If multiple package variants are created for different mounting orientations, then each orientation is optimized, but manufacturing costs and device complexity increase
Solution Approach 1:
The invention uses a single universal package design with substantially electrically identical contact patterns on multiple exterior surfaces, eliminating the need to manufacture separate package variants for different orientations. This approach maintains adaptability for multiple mounting options while significantly simplifying manufacturing processes and reducing costs associated with producing and managing multiple package types
Data Source
AI summary
A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.