Encapsulated Leadframe Package Layout for Thermal and Electrical Conduction

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Solution Overview

Problem

Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and relatively low performance with large package sizes.

Innovation Solution

The development of an electronic device comprising a substrate structure with a base and a flag, coupled with an electronic component through conductive bonds and encapsulated by an encapsulant, which includes interconnects between electrodes and leads, enhancing thermal and electrical conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electronic packages are used, then manufacturing cost is reduced, but reliability decreases and performance is limited

Engineering Contradiction:

Improvepackage reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The electronic package is divided into distinct functional segments: a substrate structure with base and flag, an electronic component, an encapsulant, and interconnect structures. This segmentation allows each component to be optimized independently for reliability while maintaining manufacturability through modular assembly processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package employs composite material structures including the encapsulant material that provides both mechanical protection and thermal management properties, combined with conductive interconnect materials to achieve enhanced reliability without excessive cost increase.

Inventive Principle:

Principle #40Composite materials

2Productivity

If conventional electronic packages are used, then manufacturing simplicity is maintained, but performance is relatively low

Engineering Contradiction:

Improvedevice performanceVSAvoidpackage structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The package structure utilizes three-dimensional spatial arrangement with the flag extending from the base, creating vertical interconnect paths and enabling enhanced thermal and electrical performance without significantly increasing planar footprint or manufacturing complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate structure with base and flag configuration serves multiple functions simultaneously: mechanical support, thermal conduction, electrical interconnection, and structural stability, thereby improving performance without proportionally increasing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If conventional electronic packages are used, then package size is large, but thermal dissipation and electrical connectivity are insufficient

Engineering Contradiction:

Improveelectrical connectivityVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The interconnect structures utilize optimized geometric paths between electrodes and leads, creating efficient current flow pathways that enhance electrical connectivity within a compact volume, reducing the overall package size while maintaining reliability.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The encapsulant contains and protects the interconnect structures and electronic component within its volume, creating a nested arrangement where smaller functional elements are housed within the larger package structure, optimizing space utilization and enhancing connectivity without increasing external dimensions.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves thermal dissipation and electrical connectivity, resulting in enhanced performance and reliability while reducing package size and cost.

Implementation Method 1

coupled with an electronic component through conductive bonds and encapsulated by an encapsulant, which includes interconnects between electrodes and leads, enhancing thermal and electrical conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

encapsulated by an encapsulant, which includes interconnects between electrodes and leads, enhancing thermal and electrical conductivity

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20260059680A1Electronic devices and methods of manufactuing electronic devices

Publication Date: 2026.02.26 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device comprises a substrate structure, comprising a base comprising a top side and a bottom side, a first lead, and a flag comprising a top side, a bottom side, and a flag lead. The electronic device also comprises an electronic component comprising a top side and a bottom side, a first electrode at the bottom side of the electronic component, and second electrode at the top side of the electronic component, an encapsulant contacting a lateral side of the electronic component and a lateral side of the base, and a first interconnect in the encapsulant, coupled between the first electrode and the first lead. The second electrode is coupled with the flag lead via the base. Other examples and related methods are also disclosed herein.