Leadframe Pillar Integrated Circuit Packaging
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in reducing package size, cost, and manufacturing time due to the use of additional substrates, which increase thickness and complexity, failing to meet demands for smaller, faster, and more reliable devices.
Innovation Solution
The method involves providing a base substrate, attaching a base device and a leadframe with a leadframe pillar, applying an encapsulant, partially exposing the leadframe pillar, and attaching a substrate connector directly below it, which improves structural integrity and reduces manufacturing costs and time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional substrate material is used for stacking integrated circuit devices, then connection patterns of leads and conductors can be achieved, but package thickness and fabrication cost increase
Solution Approach 1:
The patent merges the substrate and leadframe into a single integrated structure where the leadframe serves dual purposes as both the electrical interconnection framework and the mechanical support structure, eliminating the need for separate substrate material and reducing overall package thickness
Solution Approach 2:
The leadframe is designed to perform multiple functions simultaneously: providing electrical connections, mechanical support, and structural integrity, thereby replacing the need for additional substrate material that would otherwise be required for these functions
2Reliability
If additional substrate material is used for stacking integrated circuit devices, then connection patterns of leads and conductors can be achieved, but manufacturing cycle time and cost increase
Solution Approach 1:
By combining the substrate and leadframe functions into a single integrated component, the number of separate manufacturing steps is reduced, eliminating the need to separately fabricate and assemble substrate and leadframe, thereby reducing manufacturing cycle time
Solution Approach 2:
The leadframe is pre-configured with all necessary connection patterns and structural features during its initial fabrication, eliminating the need for subsequent substrate processing steps and reducing overall manufacturing cycle time
3Ease of manufacture
If existing manufacturing processes are reused, then cost reduction can be achieved, but package size reduction is limited
Solution Approach 1:
The patent changes the fundamental parameter of package architecture from multi-layer stacking with separate substrates to a planar leadframe-based configuration, enabling size reduction while maintaining compatibility with existing manufacturing processes
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed; and attaching a base substrate connector to the base substrate directly below the leadframe pillar.