Leadframe Power Module Layout for Smaller Package Footprint
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Solution Overview
Problem
The miniaturization of semiconductor products, particularly highly integrated power module packages, is hindered by the need for reduced physical footprint in portable devices, as existing power modules occupy excessive space due to multiple components.
Innovation Solution
A leadframe-based power module with a single in-line (SIP) type leadframe is used, where a die with an integrated control circuit is attached to the proximate end of pins, encapsulated in a mold compound, and electronic components are attached to the leadframe, with pin ends arranged perpendicular to reduce package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components (power control IC, inductors, capacitors, resistors) are used in power modules, then the functionality and performance are improved, but the physical footprint increases
Solution Approach 1:
The patent combines multiple discrete power module components (power control IC, inductors, capacitors, resistors) into a single integrated power module package. The leadframe structure integrates these components in a compact arrangement, eliminating the need for separate mounting of each component and thereby reducing the overall physical footprint while maintaining full functionality.
Solution Approach 2:
The patent employs a nested arrangement where components are positioned in overlapping or layered configurations within the leadframe. The die is mounted on the leadframe with pins extending through, and additional components are integrated in a space-efficient manner that allows one component to occupy space that would otherwise be unused by other components, minimizing the total package area.
2Area of stationary object
If a compact power module design is implemented, then the physical footprint is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary actions during the leadframe fabrication process itself, such as pre-forming the pin configurations, pre-positioning component mounting locations, and pre-integrating the die attachment structure. This preliminary preparation simplifies subsequent assembly steps and reduces manufacturing complexity despite the compact design.
Solution Approach 2:
The leadframe structure serves multiple functions simultaneously: it provides the mechanical support structure, acts as the electrical interconnection system, serves as the component mounting platform, and functions as the package enclosure. This multi-functionality reduces the number of separate manufacturing steps needed compared to traditional designs where each function requires a separate component or structure.
3Area of stationary object
If pins are arranged with distal ends perpendicular in opposite directions, then the package footprint is minimized, but the pin configuration complexity increases
Solution Approach 1:
The patent employs asymmetric pin configurations where pins are deliberately arranged with distal ends extending in opposite perpendicular directions rather than uniform orientations. This asymmetric arrangement optimizes space utilization by fitting pins into available spaces on opposite sides of the package, minimizing the footprint while the complexity is managed through systematic design patterns.
Solution Approach 2:
The patent transitions from a two-dimensional planar pin arrangement to a three-dimensional configuration where pins extend in multiple directions (opposite perpendicular directions) from the leadframe. This use of additional spatial dimensions allows for more efficient space utilization and smaller footprint while the pin configuration complexity is managed through the regularity of the multi-directional pattern.
Data Source
AI summary
An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.