Leadframe Power Routing for Low-Voltage-Drop Electronic Packages
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Solution Overview
Problem
Long power routing paths through substrates in electronic packages cause significant voltage drops, degrading performance and necessitate improved power transmission solutions.
Innovation Solution
Incorporation of a leadframe with patterned parts that provide multiple power paths and ground connections beneath the electronic component, along with a power regulating component to manage and distribute power efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power is routed through substrate routing features (conductive vias, pads, wires), then power can be transmitted to the electronic component, but the long routing path causes significant voltage drop and performance degradation
Solution Approach 1:
The leadframe is divided into multiple segments including a first patterned part, second patterned part, third patterned part, and fourth patterned part, each providing separate power transmission paths. This segmentation creates multiple parallel power delivery routes to the electronic component, reducing the effective path length and minimizing voltage drop in each individual path while maintaining reliable power transmission.
2Reliability
If multiple power paths are provided through leadframe patterned parts, then voltage drop is reduced and power transmission is improved, but the device structure becomes more complex
Solution Approach 1:
The leadframe patterned parts serve multiple functions simultaneously: they provide mechanical support for the electronic component, establish electrical connections through multiple power paths, and create ground references. This multi-functionality reduces the need for separate structures for each function, thereby limiting the increase in device complexity while achieving improved power transmission stability.
Solution Approach 2:
The patent combines the power transmission function and ground reference function into a single integrated leadframe structure. The first, second, third, and fourth patterned parts are merged into one continuous leadframe assembly that simultaneously provides multiple power paths and ground connections, reducing the overall number of discrete components and simplifying the device structure.
3Reliability
If power and signal paths are separated to reduce interference, then signal quality is improved, but the routing path length increases and voltage drop worsens
Solution Approach 1:
The leadframe patterned parts are strategically positioned and configured with specific local characteristics - the first, second, third, and fourth patterned parts are arranged to provide optimized local power delivery zones. This local quality approach ensures that power is delivered efficiently at each specific location on the electronic component, reducing overall voltage drop while maintaining proper separation between power and signal paths to preserve signal quality.
Data Source
AI summary
An electronic package is provided. The electronic package includes an electronic component and a leadframe. The electronic component has a passive surface. The leadframe includes a first patterned part under the electronic component and configured to provide a power to the electronic component by the passive surface.