Leadframe Heat Dissipation via Press-Fit Recessed Region
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Solution Overview
Problem
Current semiconductor device package assemblies face high production costs due to the use of expensive materials and complex metallurgy processes for heat dissipation, particularly in heat sinks and heat spreaders, which increase overall production costs and material waste.
Innovation Solution
The implementation of a semiconductor device package assembly using multiple leadframe portions with uniform thicknesses, where a recessed region in one leadframe portion is press-fitted with another, allowing for efficient heat dissipation without the need for costly heat spreaders or sinks, reducing material and manufacturing costs by utilizing thinner, less expensive metal sheets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks or heat spreaders are used for heat dissipation, then heat dissipation efficiency is improved, but production cost increases
Solution Approach 1:
The patent combines the heat dissipation function with the leadframe structure by integrating a heat dissipation portion into the leadframe. This merging eliminates the need for separate heat sinks or heat spreaders, thereby reducing production costs while maintaining effective heat dissipation capabilities through the integrated metal structure.
Solution Approach 2:
The leadframe is designed to serve multiple functions: it provides structural support, electrical connection, and heat dissipation. The heat dissipation portion is formed as part of the leadframe structure, allowing the same component to perform both mechanical support and thermal management functions, thus eliminating the need for additional dedicated heat dissipation components.
2Temperature
If heat sinks are used for heat dissipation, then heat dissipation efficiency is improved, but material waste increases
Solution Approach 1:
The heat dissipation function is merged into the leadframe structure itself, eliminating the need for separate heat sink components that would generate material waste during manufacturing. The heat dissipation portion is formed from the same metal sheet as the leadframe, maximizing material utilization and minimizing waste.
3Temperature
If heat spreaders with complex metallurgy processes are used, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation portion is merged with the leadframe and formed using the same stamping process. This integration eliminates the need for complex metallurgy processes that would be required to produce separate heat spreaders with specialized thermal properties, thereby simplifying manufacturing while maintaining heat dissipation effectiveness.
Solution Approach 2:
The patent modifies the geometric parameters of the leadframe structure by adding a heat dissipation portion with specific dimensional characteristics (area, thickness, configuration) to enhance thermal performance. By optimizing these geometric parameters rather than changing material composition or employing complex metallurgy, the patent achieves improved heat dissipation without increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces overall production costs by minimizing material waste and eliminating the need for complex metallurgy processes, while maintaining effective heat dissipation capabilities, thus providing a cost-effective solution for semiconductor device packages.
Implementation Method 1
a bottom surface of the second leadframe portion is in contact with the bottom of the recessed region... efficient heat dissipation capabilities
Data Source
AI summary
In a general aspect, a semiconductor device package assembly can include a first leadframe portion. The first leadframe portion can have a recessed region defined therein. The recessed region can have a sidewall and a bottom. The assembly can also include a second leadframe portion that is press-fit into the recessed region, such that a bottom surface of the second leadframe portion is in contact with the bottom of the recessed region. The second leadframe portion can be retained in the recessed region by mechanical force between an outer surface of the second leadframe portion and an inner surface of the sidewall, where the outer surface of the second leadframe portion can be in contact with the inner surface of the sidewall.