Leadframe Resin Layout to Prevent Bonding Cracks in Semiconductors
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing stress and crack propagation in conductive bonding materials due to the exposure of leads and connectors, leading to potential detachment and reduced operational reliability.
Innovation Solution
The semiconductor device incorporates a configuration with multiple leads and connectors that are partially covered by a sealing resin, ensuring proper insulation and bonding, reducing stress on conductive materials and preventing crack propagation by distributing bonding material across multiple surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads and connectors are exposed from the sealing resin, then electrical connection and mounting functionality are achieved, but stress concentration and crack propagation occur in conductive bonding materials
Solution Approach 1:
The patent applies beforehand cushioning by designing the sealing resin to cover and protect the bonding material interfaces before stress and cracks can propagate. The sealing resin acts as a protective barrier that distributes mechanical stress away from the conductive bonding material, preventing crack initiation and propagation at the bonding interfaces between leads and connectors.
Solution Approach 2:
The sealing resin functions as a protective shell that encapsulates the bonding material interfaces. This flexible protective layer absorbs and distributes mechanical stress, preventing direct stress concentration on the brittle bonding material while maintaining the electrical and mechanical functionality of the exposed leads and connectors.
2Reliability
If bonding material is concentrated at lead interfaces, then electrical connection is achieved, but crack propagation occurs reducing device integrity
Solution Approach 1:
The patent converts the potentially harmful stress concentration at bonding interfaces into a beneficial stress distribution pattern. The sealing resin is designed to redirect and distribute the mechanical stress that would otherwise concentrate at the bonding material interfaces, transforming a harmful stress concentration into a beneficial stress distribution that prevents crack propagation while maintaining bonding integrity.
Solution Approach 2:
The sealing resin acts as a flexible protective shell that encapsulates the bonding interfaces. This shell distributes mechanical loads evenly across the bonding material, preventing stress concentration that would lead to crack propagation, while still allowing the leads and connectors to perform their electrical and mechanical functions.
Data Source
AI summary
A semiconductor device includes: a semiconductor element; a sealing resin configured to cover the semiconductor element, the sealing resin including a resin main surface and a resin back surface, a first resin side surface, and a second resin side surface; a first lead including a first back surface, a first end surface, and a second end surface; a second lead electrically connected to the semiconductor element and including a second back surface exposed from the resin back surface and a third end surface exposed from the first resin side surface; a third lead provided between the first lead and the second lead in the first direction and including a third back surface exposed from the resin back surface and a fourth end surface exposed from the first resin side surface; and a first connector configured to connect the first lead and the third lead.