Leadframe Resin Fixing for Stable Semiconductor Package Connections
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Solution Overview
Problem
The miniaturization of semiconductor devices is hindered by the susceptibility of lead frames to deformation under external forces and weight, leading to reduced yields due to connection failures between semiconductor chips and leads.
Innovation Solution
A method involving a lead frame intermediate body where a first sealing resin fixes the leads to a frame member, preventing deformation and ensuring secure bonding of the semiconductor chip, and a second sealing resin seals the chip, maintaining electrical connection integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If lead frames are used to support multiple leads, then productivity is improved by enabling simultaneous mounting of multiple semiconductor chips, but the lead frames become susceptible to deformation under external forces and weight, worsening reliability
Solution Approach 1:
The support structure is divided into modular lead frame units, each independently supporting specific leads. This segmentation allows the leads to be individually positioned and secured, reducing the susceptibility of the entire structure to deformation while maintaining the capability for simultaneous mounting of multiple semiconductor chips.
Solution Approach 2:
The lead frames are pre-formed with specific geometric configurations and mounting structures before the semiconductor chips are mounted. This preliminary preparation ensures that the leads are already positioned and structurally stabilized, reducing deformation risk during the subsequent mounting and operation phases while maintaining high productivity.
2Reliability
If lead frames are made more rigid to prevent deformation, then reliability is improved, but the complexity of manufacturing increases, worsening ease of manufacture
Solution Approach 1:
The lead frames utilize geometric parameter optimization and material property selection to achieve the required rigidity and deformation resistance. By carefully selecting dimensions, thickness, and material characteristics, the lead frames attain structural stability without requiring overly complex manufacturing processes or additional supporting components.
3Ease of manufacture
If the lead frame structure is simplified to ease manufacturing, then ease of manufacture is improved, but the leads become more susceptible to deformation, worsening reliability
Solution Approach 1:
The lead frames employ thin-film structures with optimized geometric patterns that provide sufficient rigidity and deformation resistance while maintaining manufacturing simplicity. These thin-film lead frames are easier to manufacture than bulk structures yet retain adequate structural stability to prevent lead deformation during mounting and operation.
Data Source
AI summary
A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.