Leadframe Socket for Solderless Pins
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Solution Overview
Problem
Conventional semiconductor package assemblies using hard materials in leadframes face challenges such as high manufacturing costs, coil-set issues, and lead co-planarity problems, which are not effectively addressed by existing technologies.
Innovation Solution
The use of a leadframe with a socket member having an opening to receive solderless pins, made from softer copper-based materials, which reduces manufacturing costs and eliminates the need for two stamping tools, and features a smaller width and tapered holes for secure pin connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hard materials are used in leadframes, then strength is improved, but manufacturing cost increases and coil-set issues occur
Solution Approach 1:
The patent changes the material parameter from hard materials to softer copper-based materials, resolving the contradiction by finding an optimal material property that provides sufficient strength while enabling easier manufacturing and eliminating coil-set issues
Solution Approach 2:
The patent uses composite construction with a copper-based leadframe body and separate socket members, combining the advantages of soft copper material with the functional benefits of integrated sockets to achieve both ease of manufacture and structural integrity
2Strength
If hard materials are used in leadframes, then strength is improved, but coil-set and lead co-planarity problems occur
Solution Approach 1:
The patent changes the material parameter from hard materials to softer copper-based materials, which eliminates coil-set issues and maintains lead co-planarity while providing sufficient strength through optimized design
3Manufacturing precision
If two stamping tools are used, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent merges the socket structure into the leadframe itself, allowing both the leadframe and sockets to be formed in a single stamping operation, thereby reducing device complexity while maintaining manufacturing precision
Solution Approach 2:
The leadframe is designed to serve multiple functions: providing structural support, electrical connectivity, and housing for sockets, all in a single component that can be manufactured with one stamping tool
4Productivity
If leadframe width is reduced, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material to softer copper-based material, which is more formable and easier to work with, allowing for reduced leadframe width while maintaining adequate manufacturing precision through the material's inherent formability
Data Source
AI summary
In a general aspect, a method can include coupling a semiconductor component to a leadframe. The leadframe can include a socket member having a first end portion and a second end portion. The socket member can further include an opening disposed between the first end portion and the second end portion. The opening of the socket member can be configured to receive a solderless pin. The method can also include encapsulating, in a molding compound, at least a portion of the leadframe and at least a portion of the semiconductor component such that the opening of the socket member is exposed through the molding compound.