Integrated Circuit Leadframe With Staggered Die Pad Rim
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Solution Overview
Problem
Current integrated circuit leadframe designs require a separate ground ring, which increases wire length, manufacturing costs, and susceptibility to wire sweeping and breakage during molding, while also complicating wire bonding due to the need for indirect clamping.
Innovation Solution
A leadframe with a die pad featuring a discrete, alternately staggered surface configuration on its rim, providing space for ground and down bond connections and securely locking the mold compound, eliminating the need for a separate ground ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate ground ring structure is used, then ground connections are facilitated, but wire length increases and wire sweeping/breakage susceptibility increases
Solution Approach 1:
The patent merges the ground ring structure with the die pad by forming a ground ring groove directly in the die pad, eliminating the need for a separate ground ring component. This integration allows ground bonds to be made directly to the die pad while maintaining reliable ground connections, thereby reducing wire length and minimizing wire sweeping and breakage during molding.
2Reliability
If a separate ground ring structure is used, then ground connections are facilitated, but manufacturing complexity and costs increase
Solution Approach 1:
The patent combines the ground ring functionality into the die pad structure by forming a ground ring groove directly in the die pad. This eliminates the need for a separate ground ring component, reducing leadframe structure complexity and manufacturing steps while maintaining reliable ground connections.
Solution Approach 2:
The patent extracts the separate ground ring component from the leadframe structure and integrates its functionality directly into the die pad through a ground ring groove, thereby simplifying the overall device complexity while preserving ground connection reliability.
3Stability of the object's composition
If continuous grooves are provided in the die pad, then molding compound locking is improved, but ground bond connection space is reduced
Solution Approach 1:
The patent segments the continuous groove into a ground ring groove with discrete alternating staggered configurations. This segmentation provides specific designated areas for ground bond connections while maintaining the groove structure for molding compound locking, thereby resolving the conflict between connection space and locking stability.
Solution Approach 2:
The patent applies local quality by creating specific ground ring grooves in particular locations around the die pad perimeter, with alternating staggered configurations that provide both molding compound locking and ground bond connection space in different local areas, rather than using a uniform continuous groove throughout.
Data Source
AI summary
An integrated circuit leadframe and a fabrication method for fabricating the integrated circuit leadframe include forming a leadframe having leads around a die pad that has a peripheral die pad rim. A discrete, alternately staggered surface configuration is formed in the die pad rim. The discrete, alternately staggered surface configuration creates space in the die pad for connecting and separating ground bond wire-bonds and down bond wire-bonds, and provides for locking encapsulant firmly to the die pad.