Leadframe Support Bracket for Wire Spacing Stability

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Solution Overview

Problem

During the overmolding process of circuit boards, the force of the mold material can cause wires connecting dies to deform, leading to potential electrical arcing due to insufficient spacing, which is not effectively addressed by existing technologies.

Innovation Solution

A support bracket is integrated between die pads in the leadframe, featuring a planar surface that maintains the wires at a predetermined distance from the dies, providing upward reaction force and frictional resistance to prevent deformation and arcing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wires are allowed to extend freely between dies during overmolding, then manufacturing simplicity is maintained, but wire deformation and electrical arcing occur due to insufficient spacing

Engineering Contradiction:
Improvewire spacing stabilityVSAvoidleadframe structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A support bracket is introduced as an intermediary component between the dies and the wire. The bracket includes a support surface positioned at a predetermined distance from the die pad, which physically supports the wire during overmolding to maintain proper spacing and prevent deformation and electrical arcing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The support bracket is pre-positioned on the leadframe before the wire is attached and before the overmolding process occurs. The bracket is configured in advance to provide support at the correct height and location, ensuring the wire maintains proper spacing throughout the subsequent manufacturing steps.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If wire spacing is increased to prevent arcing, then electrical safety is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveelectrical arc preventionVSAvoidwire positioning precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The support bracket serves as a mechanical intermediary that physically enforces the required spacing between the wire and the die pad. By providing a support surface at a predetermined distance from the die pad, the bracket ensures adequate spacing is maintained without requiring high precision in wire placement or tension control during manufacturing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The support bracket effectively prevents wire sagging and sweeping, ensuring the wires remain at a safe height during overmolding, thereby preventing electrical arcing and reducing the need for costly x-ray inspections, while optimizing manufacturing efficiency.

Implementation Method 1

providing upward reaction force and frictional resistance to prevent deformation and arcing

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS10811343B2Method of making a wire support leadframe for a semiconductor device
Publication Date: 2020.10.20 TEXAS INSTRUMENTS INC
  • US10811343B2 patent drawing
  • US10811343B2 patent drawing
  • US10811343B2 patent drawing

AI summary

A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.