Leadframe Terminal Layout for Uniform Current Sharing
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Solution Overview
Problem
Conventional leadframe designs for power converters in electric axle drives of motor vehicles result in non-uniform current distribution and differential loading of semiconductors due to the positioning of semiconductor components, leading to inefficiencies in current conduction and potential thermal and electrical limitations.
Innovation Solution
A method for manufacturing a terminal apparatus with a leadframe that allows for a parallel arrangement of current-conducting paths, where some paths are connected to semiconductor source potentials and others are not, enabling consistent current conduction and uniform loading of semiconductors through a centralized power-source connection and parallel routing of currents without connecting power semiconductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional leadframe designs are used for positioning semiconductor components, then the manufacturability of the leadframe is improved, but non-uniform current distribution and differential loading of semiconductors occur
Solution Approach 1:
The leadframe is segmented into multiple independent current-conducting paths (first path, second path, third path) that can be individually configured and routed. This segmentation allows each path to be optimized for uniform current distribution while maintaining overall manufacturability through standardized fabrication processes.
Solution Approach 2:
Different regions of the leadframe are assigned different functions: some areas provide mechanical support, while other areas are specifically designed as current-conducting paths with optimized geometry for uniform current distribution. The path section includes parallel paths with specific width and spacing to ensure equal current sharing.
2Ease of operation
If semiconductor components are positioned according to conventional leadframe designs, then assembly is simplified, but parallel current conduction is limited
Solution Approach 1:
Multiple current-conducting paths are merged into a single integrated leadframe structure, allowing parallel current conduction through physically separate but electrically connected paths. This combining approach enables high current efficiency while maintaining assembly simplicity through a unified component.
Solution Approach 2:
The leadframe utilizes three-dimensional spatial arrangement with paths extending in different directions and planes. The path section includes paths that run parallel to each other and connect to different terminals, creating a multi-dimensional current distribution network that enhances conduction efficiency.
3Manufacturing precision
If a centralized power-source connection is implemented, then uniform current distribution is achieved, but the leadframe design becomes more complex
Solution Approach 1:
The leadframe employs asymmetric design where the path section has non-uniform geometry - paths are closer together in some regions and farther apart in others, with varying widths and routing patterns. This asymmetric configuration is specifically engineered to achieve uniform current distribution despite the overall complex appearance.
Solution Approach 2:
The leadframe is designed with pre-calculated path dimensions, spacing, and routing that are optimized beforehand to ensure uniform current distribution. The path section geometry is predetermined through design calculations and manufacturing data, eliminating the need for complex real-time adjustments during assembly.
Data Source
AI summary
A method for manufacturing a terminal apparatus for connecting at least one electrical or electronica component for an electrical or electronic module includes bending a pre-machined sheet metal element, having a first electric terminal device for connecting to a first electrical potential, a control terminal having at least one control contact, and a second electric terminal device arranged between the first electric terminal device and the control terminal for connecting to a second electrical potential, wherein the second electric terminal device has a path section including a first path for contact-connection with a terminal for the second electrical potential of the electrical or electronic component, and at least one second path arranged in parallel with the first path, and wherein a first bending section of the first path is bent into a lower plane than a second bending section of the second path in order to form the terminal apparatus.