Semiconductor Leadframe Thermocouple for Junction Temperature Sensing
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Solution Overview
Problem
In semiconductor devices, especially discrete components, there is a challenge in accurately measuring the temperature without occupying valuable space, as traditional temperature sensors like diode sensors or thermistors require significant mounting area and can reduce the active area available for intended use.
Innovation Solution
The semiconductor device incorporates a thermocouple configuration using wires made of metals with different thermoelectric powers, where one wire is connected to the source electrode of the semiconductor element, allowing for temperature measurement through thermoelectromotive force without the need for a dedicated temperature sensor, thereby preserving space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a traditional temperature sensor (diode sensor or thermistor) is provided inside the semiconductor device, then temperature measurement capability is achieved, but the mounting area is increased and active area is reduced
Solution Approach 1:
The patent merges the temperature measurement function with the existing source electrode and lead structure. The source electrode serves dual purposes: as an electrical connection and as a temperature sensing element. The lead structure is combined with thermocouple wires to create an integrated temperature detection system that requires no additional mounting space.
Solution Approach 2:
The source electrode and lead structures are designed to perform multiple functions simultaneously. The source electrode acts as both an electrical connection terminal and a temperature sensing element. The lead serves as both a structural support and a conduit for thermocouple wires, enabling temperature measurement without requiring dedicated sensor components.
2Measurement precision
If a temperature detection element is formed within the power transistor formation area, then accurate temperature detection is achieved, but the space for intended use in active area is reduced
Solution Approach 1:
The temperature detection function is merged with the power transistor formation area by using the source electrode as the sensing element. The lead structure is combined with thermocouple wires, allowing temperature detection to occur within the existing structural footprint without encroaching on the active transistor formation area.
Solution Approach 2:
The existing source electrode and lead structures serve the additional function of temperature detection. The source electrode, which is already present as part of the transistor structure, automatically functions as a temperature sensor through its integration with the thermocouple system, eliminating the need for separate detection elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables accurate temperature measurement of the semiconductor element without occupying additional space, improving reliability and efficiency by utilizing the existing semiconductor element's structure for temperature sensing.
Implementation Method 1
a first wire (31) and a second wire (32) made of metals having different thermoelectric powers
Data Source
AI summary
A semiconductor device includes a first lead, a second lead, a third lead, a semiconductor element mounted on the third lead, a first wire, and a second wire. The first lead includes a first pad portion, and a first terminal for measuring a temperature. The second lead includes a second pad portion, and a second terminal portion for measuring a temperature. The semiconductor element includes an element obverse surface, and a first electrode arranged on the element obverse surface. The first wire and the second wire are made of metals having different thermoelectric powers. The first wire is connected to the first electrode and the first pad portion. The second wire is connected to the first electrode and the second pad portion.