Lead Frame Bonding Wire Layout for Triangular Loop Reliability
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Solution Overview
Problem
Existing semiconductor devices with lead frames face challenges in preventing deformation or breakage of bonding wires during manufacturing, particularly due to the susceptibility of wires in triangular loops and the potential for enlargement of the sealing resin, which affects the reliability of the electronic device.
Innovation Solution
The electronic device is configured such that the length of the bonding wires is between 25% and 65% of the average of specific distances between bonding segments and boundaries, and the wires form a triangular loop, which helps prevent deformation or breakage while avoiding enlargement of the sealing resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding wires are made long to prevent deformation, then the reliability of wire connection is improved, but the sealing resin may enlarge and affect device compactness
Solution Approach 1:
The patent applies parameter changes by precisely controlling the bonding wire length within a specific range (25%-65% of the average distance between bonding segments and lead frame boundaries). This quantitative parameter optimization prevents wire deformation and breakage while avoiding excessive sealing resin volume increase, thereby resolving the contradiction between reliability and device compactness.
2Strength
If the bonding wires form a triangular loop configuration, then the wire strength and deformation resistance are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs the triangular loop configuration which introduces curvature and geometric stability to the bonding wire structure. This triangular geometry inherently provides mechanical strength and resistance to deformation, while the specific size constraints ensure that the manufacturing precision requirements remain manageable through proper process control.
3Volume of moving object
If the bonding wire length is reduced to prevent sealing resin enlargement, then the device compactness is improved, but the wires become more susceptible to deformation and breakage
Solution Approach 1:
The patent resolves this contradiction by establishing a minimum wire length parameter (25% of the average distance) that ensures sufficient mechanical strength and deformation resistance. This parameter optimization allows the sealing resin volume to be minimized while maintaining wire connection reliability, achieving both compactness and reliability.
4Stability of the object's composition
If the triangular loop configuration is used for bonding wires, then the deformation resistance is improved, but the complexity of wire layout increases
Solution Approach 1:
The triangular loop configuration provides inherent structural stability and deformation resistance through its geometric form. While this does increase layout complexity compared to straight wires, the standardized triangular pattern simplifies the design process and ensures consistent mechanical performance, making the increased complexity manageable and worthwhile for the stability gained.
Data Source
AI summary
An electronic device includes: an electronic component; a sealing resin covering the electronic component; a first lead including a first inner portion and a first outer portion; a second lead including a second inner portion and a second outer portion; and a wire including a bonding segment secured to the first inner portion and a bonding segment secured to the second inner portion. The first inner portion is located inside a peripheral edge of the sealing resin as viewed in a thickness direction z, except at a first boundary with the first outer portion. The second inner portion is located inside the peripheral edge of the sealing resin as viewed in the thickness direction z, except at a second boundary with the second outer portion. As viewed in the thickness direction z, the wire has a length that is at least 25% of an average of a distance from the first boundary to the bonding segment secured to the first inner portion and a distance from the second boundary to the bonding segment secured to the second inner portion.