Leadframe Trimming Sequence for Clean Dam Bar and Tie Bar Cuts

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Solution Overview

Problem

The premature wear of cutting tools used for removing dam bars and tie bars in integrated circuit (IC) packages leads to uneven mold flash remnants, IC package failures, and increased operating costs due to frequent tool replacement.

Innovation Solution

A multi-step trimming process using a cutting tool with an angular cutting tip to remove tie bars and a punch portion to remove dam bars, reducing wear and ensuring clean cuts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a single-step trimming process is used to remove tie bars and dam bars, then the process is simple and fast, but the cutting tool wears prematurely creating jagged edges and uneven mold flash

Engineering Contradiction:
Improvetrimming process efficiencyVSAvoidcutting edge quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The trimming process is divided into two separate steps: first removing tie bars, then removing dam bars. This segmentation allows each cutting operation to be optimized independently, preventing premature tool wear and maintaining cutting edge quality throughout the process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The tie bars are removed first as a preliminary action before removing the dam bars. This sequence reduces the overall cutting load on the tool during the second step, extending tool life and maintaining precision.

Inventive Principle:
Principle #10Preliminary action

2Loss of energy

If cutting tool is used frequently without replacement, then operating costs are reduced, but the cutting edge becomes worn and creates IC package failures

Engineering Contradiction:
Improveoperating costVSAvoidIC package reliability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

By segmenting the trimming into two steps with different cutting requirements, the tool experiences less cumulative wear per step, extending its usable life while maintaining reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The multi-step process changes the cutting parameters (load, material being cut) between steps, reducing the rate of tool wear and allowing the tool to operate reliably for longer periods.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If cutting tool is replaced frequently to maintain quality, then cutting edge quality is maintained, but production time is lost and operating costs increase

Engineering Contradiction:
Improvecutting edge qualityVSAvoidproduction continuity
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The segmented trimming process distributes the cutting load across multiple lighter operations, reducing tool wear rate and extending the interval between tool replacements, thus maintaining productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Removing tie bars first as a preliminary step reduces the burden on subsequent cutting operations, allowing the tool to maintain its cutting edge quality for longer periods.

Inventive Principle:
Principle #10Preliminary action

4Productivity

If jagged cutting edges are allowed to continue cutting, then production continues without interruption, but uneven mold flash remnant is created leading to package failure

Engineering Contradiction:
Improveproduction continuityVSAvoidpackage reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

Dividing the trimming into two steps prevents the accumulation of damage from jagged cutting edges, as each step uses the tool while it is still relatively sharp, ensuring clean cuts and preventing package failures.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240379506A1Electronic device with improved leadframe trimming process
Publication Date: 2024.11.14 TEXAS INSTRUMENTS INC
  • US20240379506A1 patent drawing
  • US20240379506A1 patent drawing
  • US20240379506A1 patent drawing

AI summary

A method of fabricating electronic devices includes providing an array of leadframes, the array of leadframes including leads, tie bars, and dam bars and attaching a die to each leadframe of the array of leadframes. Wire bonds are attached from an active side of the die to the leads on each leadframe of the array of leadframes. A mold compound is formed over the die, the wire bonds, and a portion of the leads on each leadframe of the array of leadframes. A multi-step trimming process is performed to the array of leadframes to remove the tie bars and the dam bars from each of the leadframes of the array of leadframes.