Leadframe Connection Assembly for Universal Singulation Tooling
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Solution Overview
Problem
Existing IC package fabrication processes require multiple punch tools for different lead configurations, increasing costs due to the need for specialized tooling for IC packages with varying lead counts.
Innovation Solution
A specially designed leadframe with a connection assembly that compensates for depopulated leads, allowing a single punch and trimming tool to be used for various leadframe configurations, including those with or without depopulated leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple punch tools are used for different lead configurations, then manufacturing precision is maintained for various IC package types, but device complexity and manufacturing cost increase
Solution Approach 1:
The connection assembly is designed to provide universal functionality across different leadframe configurations. By including connection pieces that can connect to either a first external lead or a second external lead adjacent to a depopulated lead, the same punch and trimming tool can process both standard and depopulated leadframe configurations, eliminating the need for multiple specialized tools while maintaining manufacturing precision
2Manufacturing precision
If multiple punch tools are used for different lead configurations, then manufacturing precision is maintained, but manufacturing cost increases
Solution Approach 1:
The connection assembly enables a single punch and trimming tool to handle multiple leadframe configurations. The connection pieces are designed to connect to different leads based on configuration needs, allowing the same tooling to process both standard and depopulated leadframes, thereby reducing tooling costs while maintaining precision
Solution Approach 2:
The invention changes the structural parameters of the leadframe by adding connection pieces that can be selectively connected to different leads. This parameter change in the leadframe design allows a single tool to adapt to different configurations, reducing the need for multiple specialized tools and lowering manufacturing costs
3Adaptability or versatility
If depopulated leads are present in leadframes, then adaptability to different IC package types is improved, but the singulation process complexity increases
Solution Approach 1:
The connection assembly provides universal processing capability for the singulation tool. By designing connection pieces that can connect to either the first external lead or the second external lead adjacent to the depopulated lead, the same punch and trimming tool can process both standard and depopulated configurations without requiring different processes, thereby maintaining adaptability while simplifying the singulation process
Data Source
AI summary
An electronic device and method are provided. The method includes providing an array of electronic devices having leadframes where the leadframes include at least one depopulated lead and external leads interconnected by a first dambar, a second dambar, and a connection assembly. The connection assembly connects the first dambar to a first external lead of a first leadframe and to a second external lead of a second adjacent leadframe. A first punch process is performed to remove the first dambar and the second dambar from the leadframes. A second punch process is performed to create a cut in the connection assembly proximate the first external lead adjacent to the at least one depopulated lead to disconnect the connection assembly from the first external lead. A trimming process is performed to trim external leads of the leadframes to their required length while simultaneously removing the connection assembly.