Leadless Component Encapsulation with Roller De-coating
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Solution Overview
Problem
Conventional methods for packaging leadless electronic components face issues with uneven and incomplete protective layer coating, leading to reliability and yield rate problems due to the incorporation of inorganic fillers, which affect the surface finish and thermal conductivity.
Innovation Solution
A method involving a mould with upper and lower grooves for thermoforming, using protective materials with over 50% inorganic filler, and a roller with high-rigidity intermediates for physical churns to ensure uniform coating and removal of excessive layers, enhancing surface smoothness and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polymer protective layer is printed on the columnar ceramic core with a roller, then the protective layer is coated on the electronic component, but the protective layer covers the metal heads at both sides causing bubbles and surface depression
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses at both ends of the cylindrical ceramic core before coating the protective layer. These recesses are created in advance to prevent the protective material from covering the metal heads, thereby avoiding bubbles and surface depression issues that would compromise reliability and surface finish
Solution Approach 2:
The patent implements local quality by creating localized recesses only at the ends of the ceramic core where metal heads are located. This selective modification ensures that the protective layer is applied uniformly on the cylindrical surface while leaving the metal heads exposed, resolving the contradiction between comprehensive protection and precise surface finish
2Reliability
If inorganic filler is added to decrease water absorption rate and increase heat conductivity, then the protective layer has improved functional properties, but the fluidity of materials deteriorates causing incomplete or uneven coating
Solution Approach 1:
The patent applies parameter changes by carefully controlling the proportion of inorganic filler in the protective material composition. By optimizing the filler content and selecting appropriate filler particle sizes and distributions, the patent achieves both improved functional properties (lower water absorption, higher heat conductivity) and maintained material fluidity for complete and even coating
Solution Approach 2:
The patent implements composite materials by combining organic polymer matrix with inorganic filler particles to create a protective material that exhibits both the desired functional properties (from inorganic filler) and adequate processability (from polymer matrix). This composite approach resolves the contradiction between enhanced performance and manufacturing ease
3Manufacturing precision
If protective layers are repeatedly coated on the electronic component to obtain an even surface, then the surface uniformity is improved, but the production time and cost increase
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses at the ends of the ceramic core before the protective layer coating process. This preliminary structural modification ensures that a single coating pass produces a uniform surface without defects, eliminating the need for repeated coating cycles and thereby maintaining high production yield rates while achieving excellent surface evenness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in electronic components with flat, smooth, and protected surfaces, improved yield rates, and extended service life by ensuring uniform coatings and higher thermal conductivity through the use of inorganic fillers.
Implementation Method 1
inject heated and softened protective materials into the mould so that the protective materials are coated on the cylindrical bodies as protective layers
Implementation Method 2
remove the cylindrical bodies from the upper mould and the lower mould into a roller to churn the cylindrical bodies and thereby de-coat parts of the protective layers on the front ends and the rear ends of the cylindrical bodies
Data Source
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AI summary
An encapsulation method of electronic components comprises steps as follows: preparing electronic components with cylindrical bodies wherein a cylindrical body has front and rear ends made of metals and a middle end made of ceramics and the front end or the rear end features an outer diameter greater than the middle end of the cylindrical body; preparing a mould consisting of upper and lower moulds; encasing the cylindrical bodies inside the upper and lower moulds, injecting heated and softened protective materials into the mould in which protective materials as protective layers are coated on the cylindrical bodies; injecting the cylindrical bodies removed from the upper and lower moulds into a roller in which excessive protective layers on the front and rear ends of the cylindrical bodies are de-coated.