Leadless Module Anchoring Structure for Bend-Resistant Packaging
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Solution Overview
Problem
Existing packages containing electronic leadless modules, such as biometric sensors, suffer from mechanical robustness issues during processing and operation, leading to potential damage and functional impairment due to inadequate sealing and resin application, especially under bending loads.
Innovation Solution
The introduction of an anchoring region on the side walls of the leadless module, which provides space for a greater amount of filler material, enhancing mechanical anchoring and stability by forming an undercut for the filler material, thereby increasing the package's mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the gap between the carrier tape side wall and leadless module side wall is sealed using resin, then the package is sealed, but the mechanical robustness is insufficient under bending loads
Solution Approach 1:
The leadless module side wall is designed with a curved profile instead of a straight line, creating an anchoring region that allows the resin to wrap around and mechanically interlock with the module, significantly enhancing the seal strength and mechanical robustness under bending loads
Solution Approach 2:
The anchoring region extends the seal interaction from a simple linear gap filling to a three-dimensional mechanical interlocking structure, where the resin occupies the curved anchoring region and creates multiple attachment points along the side wall
2Reliability
If resin is applied to seal the gap, then sealing is achieved, but resin may inadvertently output onto the sensor surface impairing functionality
Solution Approach 1:
The side wall is designed with different geometries at different locations: the anchoring region with curved profile for resin attachment, and the top side surface maintained flat and clean for sensor functionality, ensuring resin is localized to the anchoring region only
3Adaptability or versatility
If the leadless module is not arranged completely centrally within the opening, then placement flexibility is improved, but the gap sealing becomes inadequate
Solution Approach 1:
The curved anchoring region design ensures that regardless of the module's lateral position within the opening, the resin can always access and fill the curved profile, maintaining effective sealing and mechanical anchoring even with placement variations
Data Source
AI summary
A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material and the electronic leadless module have an anchoring region on at least one side face. The package may also include a carrier frame which carries the electronic leadless module, with the side face extending further in the direction of the carrier frame below the anchoring region than in the anchoring region, and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.