Leadless Optical Transmitter-Receiver Subassembly for High-Density Integration
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Solution Overview
Problem
The existing optical transmitter-receiver modules are limited in size due to their lead-based mounting on printed circuit boards, restricting the number of channels and requiring significant space, which is not suitable for the increasing demand of smaller and higher-density optical communication devices.
Innovation Solution
The optical transmitter-receiver subassembly is designed with a leadless structure, incorporating a planar lightwave circuit, semiconductor laser and photodiode elements, and a ceramic package with land pads for electrical connection, allowing for a compact and efficient integration onto printed circuit boards, enabling reduced size and improved heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If leads are provided onto the ceramic package for manual mounting, then electrical connection between the planar lightwave circuit and the printed circuit board is achieved, but the printed circuit board requires significant area for soldering the leads, increasing the overall module size
Solution Approach 1:
The invention extracts and eliminates the leads from the ceramic package structure. Instead of providing leads onto the ceramic package for manual mounting, the package is redesigned to be leadless, with electrical connections achieved through land pads that are directly soldered to the printed circuit board, thereby removing the need for separate lead elements and reducing the area required on the printed circuit board.
Solution Approach 2:
The invention merges the electrical connection function directly into the package structure through land pads. The land pads are integrated onto the ceramic package surface, combining the packaging function with the electrical interconnection function, eliminating the need for separate leads and reducing the overall footprint on the printed circuit board.
2Adaptability or versatility
If the optical transmitter-receiver module follows MSA size specifications, then product package size and pin arrangements can be standardized across vendors, but the size limits the number of modules that can be incorporated into a communication device, reducing channel density
Solution Approach 1:
The invention changes the physical parameters of the package by eliminating leads and reducing the package footprint. The leadless package design reduces the overall size of the optical transmitter-receiver module while maintaining compatibility with standard mounting processes, thereby increasing the number of modules that can be incorporated into a communication device and improving channel density.
3Ease of operation
If leads are used for electrical connection, then current can be input/output between the planar lightwave circuit and the exterior, but the manual mounting process and soldering requirements increase device complexity and reduce assembly efficiency
Solution Approach 1:
The invention extracts the leads from the package structure, eliminating the manual mounting and soldering of separate lead elements. The electrical connection is achieved through land pads that are directly soldered to the printed circuit board, simplifying the assembly process and reducing device complexity while maintaining full electrical connection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This leadless structure allows for downsizing of the optical transmitter-receiver modules, enabling higher channel density and easier assembly, while maintaining strength and improving heat radiation, thus addressing the space constraints and heat management issues in optical communication devices.
Implementation Method 1
a light-emitting element which converts a current into an output optical signal
Implementation Method 2
a light-receiving element which converts an input optical signal from an optical fiber into a current
Implementation Method 3
a planar lightwave circuit which guides the output optical signal and the input optical signal
Data Source
AI summary
An optical transmitter-receiver subassembly including a light-emitting element which converts a current into an output optical signal, a light-receiving element which converts an input optical signal from an optical fiber into a current, a planar lightwave circuit which guides the output optical signal and the input optical signal, and comprises the light-emitting element and the light-receiving element, a first land pad through which the current to be input to the light-emitting element passes, a second land pad through which the current output from the light-receiving element passes, a package which is electrically coupled to the planar lightwave circuit and includes the first land pad and the second land pad.