Leadless IC Package With Plated Lead Flanges
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Solution Overview
Problem
The challenge lies in creating an integrated circuit leadless package system that addresses the issues of reduced lead strength and increased susceptibility to shorting due to finer lead pitches, which affects the reliability and manufacturing yield of smaller electronic devices.
Innovation Solution
The system features a thin encapsulant region with a thinner section over the leads compared to the integrated circuit die, providing protection and structural integrity during processing, and includes a die attach paddle for heat dissipation and grounding, along with curved inner edges on leads for improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the lead pitch is reduced to increase lead density, then the package size can be reduced, but the leads become more susceptible to shorting and deformation
Solution Approach 1:
The patent applies plating to the flange area of the leads before the singulation process. This plating acts as a protective cushion that prevents shorting between adjacent leads during clamping and cutting operations. The plating is applied in advance to anticipate and prevent the harmful effect of shorting that would occur during subsequent processing steps.
Solution Approach 2:
The patent uses composite material structure by combining the lead material with a protective plating layer on the flange area. This composite structure provides both the electrical conductivity needed for the lead function and the protective properties needed to prevent shorting during processing, thereby maintaining reliability at fine pitch configurations.
2Adaptability or versatility
If the number of leads is increased to provide more functions, then the package functionality is improved, but the manufacturing complexity and difficulty increase
Solution Approach 1:
The patent segments the protection strategy by applying plating specifically to the flange area rather than the entire lead structure. This selective segmentation provides protection where it is most needed (at the exposed flange area susceptible to shorting) while maintaining manufacturing efficiency. The segmentation allows high lead density without proportionally increasing manufacturing complexity.
3Area of stationary object
If the lead-to-lead gap is reduced to increase lead density, then the package footprint is reduced, but the susceptibility to shorting during processing increases
Solution Approach 1:
The plating is applied beforehand to create a protective barrier between adjacent leads in the fine pitch configuration. This cushioning effect prevents the harmful shorting that would otherwise occur when leads are closely spaced and subjected to clamping forces during singulation.
Solution Approach 2:
The patent converts the potentially harmful close spacing of leads into a benefit by applying plating that prevents shorting. The fine pitch configuration, which would normally increase shorting risk, becomes advantageous for reducing package footprint while the plating transforms the risk into a protected, reliable structure.
Data Source
AI summary
An integrated circuit leadless package system includes forming a lead, attaching an integrated circuit die to the lead, and applying an encapsulant including a thin encapsulant region with a thinner section over the lead than a section over the integrated circuit die.