Leadless Surface Mount Package with Exposed Lead Ends
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Solution Overview
Problem
Current surface mount technology (SMT) manufacturing processes are costly and complex, with inefficiencies in material usage and mold design, leading to increased production costs and complexity.
Innovation Solution
A leadless surface mount assembly package is developed, comprising a first lead, a second lead, a chip, and a clip, all molded together using a molding compound, with only the ends of the leads exposed, eliminating the need for a lead frame and simplifying the molding process by cutting a package array to form individual packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional SMT with lead frames is used, then reliable electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the lead frame from the packaging structure, retaining only the essential leads that directly connect to the chip. This simplifies the manufacturing process by removing the complex lead frame assembly steps while maintaining reliable electrical connections through direct lead-chip bonding.
Solution Approach 2:
The patent merges the leads, chip, and molding compound into an integrated structure where the leads are directly embedded in the molding compound holding the chip. This consolidation eliminates separate assembly steps for lead frame attachment and reduces overall structural complexity while preserving electrical connectivity.
2Strength
If traditional SMT packaging is used, then proper structural support is provided, but material waste increases
Solution Approach 1:
The patent applies local quality by providing structural support only where needed - the molding compound encapsulates and protects the chip and leads precisely at their required positions, rather than using a comprehensive lead frame structure. This localized approach maintains necessary structural integrity while minimizing material consumption.
Solution Approach 2:
The patent discards the traditional lead frame structure that consumes significant material, replacing it with a more efficient configuration where only essential leads are used. The molding compound serves multiple functions simultaneously (structural support, protection, and positioning), reducing overall material waste.
3Ease of operation
If leads extend outward from molding compound, then easy external connection is achieved, but precision and compactness deteriorate
Solution Approach 1:
The patent performs preliminary action by pre-positioning the leads within the molding compound at precise locations before final encapsulation. The leads are arranged and secured in their exact required positions during the molding process, ensuring both manufacturing precision and subsequent ease of connection without requiring post-assembly adjustments.
Data Source
AI summary
Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained.