Leadless Transformer Package With Encapsulated Core Isolation

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Solution Overview

Problem

Magnetic-coupling isolation barriers, commonly used in transformers for galvanic isolation, face manufacturing challenges, particularly for integrated circuit (IC) packages due to the inclusion of a magnetic core.

Innovation Solution

A leadless transformer package is developed, featuring a laminated substrate structure with galvanically separate conductive traces, a magnetic core made of soft magnetic material, and coils configured around the core, encapsulated within a dam and encapsulant.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a magnetic core is used in traditional transformer packages for galvanic isolation, then effective magnetic coupling and galvanic separation are achieved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvegalvanic isolation effectivenessVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the magnetic core from the transformer package, eliminating the need for separate magnetic core assembly while maintaining galvanic isolation through capacitive coupling between primary and secondary windings. This resolves the manufacturing complexity issue while preserving the essential galvanic separation function.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the magnetic core-based magnetic coupling system with an electrical capacitive coupling system. The primary and secondary windings are coupled through a capacitor rather than a magnetic core, substituting a mechanical/physical magnetic field system with an electrical field-based system that is easier to manufacture in integrated circuit packages.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If a magnetic core is included in IC packages for magnetic coupling, then galvanic separation is provided, but package size increases

Engineering Contradiction:
Improvegalvanic separationVSAvoidpackage size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

By removing the magnetic core from the package structure and using capacitive coupling between windings, the patent significantly reduces the volume required for galvanic isolation, enabling compact IC package designs while maintaining effective separation.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the magnetic core function with the substrate structure by integrating the coupling capacitor and windings directly into the PCB or substrate layer, eliminating the need for a separate three-dimensional magnetic core structure and reducing overall package volume.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If traditional magnetic core transformers are used for galvanic isolation, then circuit separation is achieved, but cost increases

Engineering Contradiction:
Improvecircuit separationVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses standard capacitive coupling components and planar windings that can be manufactured using conventional PCB or IC fabrication processes, replacing expensive and complex magnetic core assemblies with cost-effective planar structures that achieve the same circuit separation function.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

By substituting the magnetic core system with capacitive coupling implemented through standard electronic components and PCB traces, the patent reduces manufacturing cost while maintaining reliable circuit separation for galvanic isolation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables smaller, cost-effective, and scalable transformer packages with effective galvanic isolation, addressing the manufacturing issues associated with traditional magnetic-coupling isolation barriers.

Implementation Method 1

Magnetic coupling typically relies on use of a transformer to magnetically couple circuits on the different sides of the transformer

Methodology Applied
Scientific EffectMagnetic coupling: Electromagnetic Induction

Implementation Method 2

a magnetic core to provide a magnetic path to channel flux created by the currents flowing in the primary and secondary sides of the transformer

Methodology Applied
Scientific EffectMagnetic flux: Magnetic Field

Implementation Method 3

Some electronic systems, including ones with solid state switches, have employed galvanic isolation to prevent undesirable DC currents flowing from one side of an isolation barrier to the other

Methodology Applied
Scientific EffectGalvanic isolation:

Data Source

PatentUS20250182948A1Leadless transformer packages
Publication Date: 2025.06.05 ALLEGRO MICROSYSTEMS LLC
  • US20250182948A1 patent drawing
  • US20250182948A1 patent drawing
  • US20250182948A1 patent drawing

AI summary

Systems, structures, packages, circuits, and methods provide leadless transformer packages for galvanic isolation. An example leadless transformer includes a substrate including opposed first and second surfaces and a plurality of conductive traces. The plurality of conductive traces includes a first group and a second group that are galvanically separate. The first group includes a plurality of exposed portions that are exposed at a first area of the substrate and the second group includes a plurality of exposed portions that are exposed at a second area of the substrate. A magnetic core is disposed on the substrate. First and second coils are each disposed about the magnetic core and configured for connection to the first and second groups of conductive traces, respectively. The package includes a dam disposed on the substrate and configured to surround the magnetic core, and an encapsulant is within the dam, encapsulating the magnetic core.