Leaf Spring Shielding for Heat Sink Contact and Radiation Control
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Solution Overview
Problem
Existing electronic apparatuses using heat sinks for integrated circuit cooling may not effectively prevent unnecessary radiation due to the positioning of the leaf spring relative to the shields, which can compromise the radiation prevention effect.
Innovation Solution
An electronic apparatus design featuring a circuit board with an integrated circuit, a heat sink, a first shield covering one face of the circuit board, and a biasing member, such as a leaf spring, that is positioned between the circuit board and the shield to ensure contact between the heat sink and the integrated circuit while remaining electrically disconnected from the shield, thereby preventing radiation leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the leaf spring is positioned on the outer side of the shields and held in contact with plate shields, then the heat sink can be pressed against the integrated circuit, but the radiation prevention effect is compromised
Solution Approach 1:
The patent introduces a first shield as an intermediary component positioned between the circuit board and the leaf spring. This shield acts as a mediator that blocks the path of electromagnetic radiation from the circuit board to the leaf spring, preventing the leaf spring from becoming an antenna while still allowing it to perform its mechanical function of pressing the heat sink against the integrated circuit.
Solution Approach 2:
The patent extracts the radiation-blocking function from the shield structure and separates it from the mechanical pressing function performed by the leaf spring. By positioning the shield between the circuit board and the leaf spring, the radiation prevention capability is extracted and dedicated to the shield, while the leaf spring focuses solely on thermal contact pressure.
2Object-generated harmful factors
If the first shield covers the circuit board, then radiation prevention is improved, but the leaf spring cannot effectively press the heat sink
Solution Approach 1:
The patent applies local quality by making the shield selectively transparent to mechanical force while opaque to electromagnetic radiation. The shield is positioned and dimensioned to block radiation paths from the circuit board to the leaf spring, while still allowing the leaf spring to transmit pressing force locally to the heat sink through the integrated circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures effective contact between the heat sink and the integrated circuit for efficient heat transfer while suppressing unnecessary radiation, enhancing the overall radiation prevention effect.
Implementation Method 1
a biasing member (51) disposed between the circuit board (20) and the first shield (30) and configured to bias the heat sink (14) toward the one face of the circuit board (20) through the connecting member (52)
Implementation Method 2
a heat sink (14) disposed on the surface of the integrated circuit (21)... heat can be transmitted smoothly from the integrated circuit to the heat receiving block
Implementation Method 3
In order to prevent unnecessary radiation from the circuit board... generation of unnecessary radiation can be suppressed effectively
Data Source
AI summary
A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.