Leaf Spring SMD-THT Connector Assembly
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Solution Overview
Problem
The existing manufacturing processes for printed circuit boards require multiple soldering processes when mixing Surface Mounted Devices (SMD) and Through Hole Technology (THT) components, increasing costs and production time.
Innovation Solution
A device with an opening delimited by leaf spring elements for receiving a contact part, enabling a non-positive mechanical and electrical connection, allowing for the assembly of components using a single SMD soldering process, eliminating the need for wave soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple soldering processes (reflow and wave soldering) are used for mixed SMD and THT components, then both SMD and THT components can be assembled, but manufacturing costs and production time increase
Solution Approach 1:
The patent combines SMD and THT component assembly capabilities into a single soldering process. The device allows THT components to be soldered through the circuit board in the same reflow soldering process used for SMD components, eliminating the need for separate wave soldering and improving manufacturing efficiency
Solution Approach 2:
The device provides multi-functionality by enabling both SMD and THT component assembly through a single soldering process. The universal approach allows the same soldering equipment and process parameters to handle different component types, reducing process complexity and cost
2Reliability
If two separate soldering processes are used for SMD and THT components, then proper mechanical and electrical connection can be achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple soldering processes into a single reflow soldering process. By designing the device with appropriate structural features, it enables both SMD and THT components to be reliably connected through the same soldering operation, reducing process complexity while maintaining connection quality
3Manufacturing precision
If separate soldering processes are used for different component types, then each component type can be optimized, but production time increases
Solution Approach 1:
The device is designed with pre-configured structural features that enable THT components to be properly positioned and connected during the SMD reflow soldering process. This preliminary design allows both component types to be assembled in one pass, eliminating the need for additional wave soldering steps and reducing production cycle time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and time by allowing wired components to be assembled on circuit boards without additional soldering processes, while maintaining mechanical fixation and electrical contact.
Implementation Method 1
The spring action of the leaf spring elements makes it easy to establish a frictional connection and contact.
Implementation Method 2
The spring action of the leaf spring elements makes it easy to establish a frictional connection and contact.
Implementation Method 3
electrical contacting of the contact part with the device can be produced or is produced
Data Source
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AI summary
Device suitable for a material-bonded connection with a printed circuit board, wherein the device has an opening for receiving a contact part (pin), wherein the opening is limited by leaf spring elements, wherein when receiving the contact part into the opening a force-fit connection of the contact part with the leaf spring elements and an electrical contact of the contact part with the device can be established.