Leaky Waveguide Wireless IC Communication
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Solution Overview
Problem
Conductive wires and traces in integrated circuits degrade communication at high data rates and frequencies due to parasitic capacitance and inductance, making them unsuitable for interconnecting circuits over longer distances effectively.
Innovation Solution
Integration of a waveguide within the semiconductor substrate to enable wireless communication between functional modules using a multiple access transmission scheme, allowing for efficient data transfer over longer distances with reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conductive wires and traces are used for communication between integrated circuits, then communication is effective at low data rates and short distances, but communication degrades at high data rates and long distances due to parasitic capacitance and inductance
Solution Approach 1:
The patent replaces the traditional conductive wire-based communication system with a waveguide-based electromagnetic field communication system. The waveguide uses electromagnetic waves to transmit data between integrated circuits, eliminating the parasitic capacitance and inductance issues inherent in conductive wires. This substitution enables high-speed communication over longer distances while maintaining signal integrity.
2Reliability
If conductive wires and traces are used to interconnect integrated circuits, then the structure is simple and easy to manufacture, but the communication performance degrades at increased frequencies and distances
Solution Approach 1:
The patent substitutes the simple but performance-limited conductive wire interconnection structure with a waveguide structure that uses electromagnetic field propagation. While the waveguide structure is more complex than simple wires, it provides superior communication performance at high frequencies and long distances by eliminating parasitic effects through field-based transmission rather than conductor-based transmission.
3Length of stationary object
If the communication distance between integrated circuits is increased, then more circuits can be interconnected, but parasitic effects in conductive wires degrade the communication
Solution Approach 1:
The patent replaces the conductive wire transmission medium with a waveguide that propagates electromagnetic waves. This substitution eliminates the parasitic capacitance and inductance that accumulate with increased wire length, enabling communication over longer distances without signal degradation. The waveguide structure confines and guides electromagnetic energy efficiently over extended distances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The waveguide facilitates reliable and efficient wireless communication between integrated circuit modules, overcoming the limitations of conductive wires and traces by enabling high-speed data transfer without the drawbacks of parasitic effects.
Implementation Method 1
an integrated waveguide 600 that is formed onto the semiconductor substrate 104... configured to guide an electromagnetic wave to communicatively couple the functional modules 202.1 through 202.i to each other
Implementation Method 2
Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide
Data Source
AI summary
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.