3D Faceted Lead Frame for High-Output LED Lighting
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Solution Overview
Problem
Existing LED light sources face challenges in generating sufficient light output due to heat issues with larger chips and complex production processes with 2-dimensional arrays, limiting their use to accent lighting.
Innovation Solution
A three-dimensional multiple-faceted lead frame is used to create a compact and efficient light source by mounting LED chips on its facets, with a shaft and electrical connections, encapsulated in a protective material for 360-degree light emission, ease of replacement, and waterproofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chip size is increased to boost light output, then illumination intensity improves, but heat dissipation becomes more difficult and emitting efficiency decreases
Solution Approach 1:
The invention divides the LED light source into multiple separate chips mounted on different facets of a 3D lead frame. Instead of using one large chip that generates excessive heat, the total light output is achieved by combining multiple smaller chips, each with better heat dissipation characteristics. This segmentation allows the system to reach high illumination intensity while maintaining individual chip efficiency.
Solution Approach 2:
The invention transitions from a 2D array arrangement to a 3D spatial configuration using a multi-faceted lead frame. LED chips are mounted on multiple facets (surfaces) of the three-dimensional structure, utilizing vertical and angular space rather than only horizontal plane. This dimensional change increases the effective surface area for heat dissipation and allows more chips to be integrated without increasing the footprint, thereby improving both light output and thermal management.
2Power
If multiple LED chips are integrated on a 2-dimensional plate form to increase power output, then illumination intensity improves, but the footprint and production process complexity increase
Solution Approach 1:
The invention uses a three-dimensional lead frame with multiple facets to mount LED chips in a spatial configuration rather than a flat 2D arrangement. This allows chips to be positioned on vertical and angled surfaces, effectively utilizing the third dimension (height/depth) to increase the number of chips without proportionally increasing the horizontal footprint. The compact 3D structure achieves high power output in a smaller overall volume.
Solution Approach 2:
The LED chips are nested on the multiple facets of the lead frame structure, with chips arranged on different levels and angles of the 3D framework. This nesting approach allows maximum utilization of the available surface area within a compact volume, integrating multiple chips into a concentrated space-efficient configuration that reduces the overall footprint compared to spread-out 2D arrangements.
3Power
If multiple LED chips are integrated on a 2-dimensional plate form to increase power output, then power output improves, but production process complexity increases
Solution Approach 1:
The lead frame serves multiple functions simultaneously: it provides the structural framework for mounting chips, acts as the cathode electrical connection, and provides thermal conduction pathways. This multi-functionality reduces the number of separate components needed and simplifies the assembly process compared to traditional designs where the mounting substrate, electrical connections, and heat sinking are separate elements requiring multiple assembly steps.
Solution Approach 2:
The invention combines the mounting structure, electrical connection (cathode), and heat dissipation function into a single integrated lead frame component. By merging these functions into one element, the production process is simplified as fewer separate parts need to be manufactured and assembled. The lead frame serves as both the mechanical support and the electrical conductor, reducing assembly complexity while maintaining high power output through multiple integrated chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light output while maintaining a compact footprint, improving heat dissipation and simplifying production, enabling efficient and versatile LED lighting solutions.
Implementation Method 1
One or more LED chips are placed on selected facets of the lead frame to create a lighting arc which may measure up to 360 degrees
Implementation Method 2
The lead frame and chips are covered by an encapsulation structure made from epoxy, silicon, plastic, or similar material which acts as optical lens for light emitted from chip. The structure also acts as a protection layer for the chip and lead frame and, ideally, waterproofs the light source.
Data Source
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AI summary
A semiconductor light source (100) for illuminating physical spaces can include a lead frame (101) with multiple facets (104). Each facet can have one or more semiconductor light emitting devices (108) on it.