LED Access Structure for Short-Circuit-Free Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the manufacturing of optoelectronic devices, such as luminous display screens, the accurate electrical connection and positioning of light-emitting diodes (LEDs) with micrometric or nanometric dimensions are challenging due to their small size and three-dimensional shape, leading to issues with short-circuits and defective LEDs that are difficult to repair or replace without complexifying the structure and increasing costs.
Innovation Solution
An electronic system is designed with a support having an initial electronic device with lower and upper connection terminals, an electrically-insulating interlayer covering a conductive element, and a pre-existing structure like a transverse conduit providing access to the conductive element, allowing for electrical connections before and after encapsulation, and enabling the replacement of defective devices with auxiliary devices through docking locations and interposer connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light-emitting diodes are arranged with distance smaller than ten microns to increase resolution, then the resolution of the display screen is improved, but the risk of unintentional short-circuit between adjacent LEDs increases
Solution Approach 1:
The patent introduces an insulating encapsulation layer as an intermediary between adjacent light-emitting diodes. This encapsulation layer physically separates the diodes while allowing optical transmission, thereby preventing electrical short-circuits between closely spaced LEDs positioned less than ten microns apart while maintaining display resolution.
2Adaptability or versatility
If light-emitting diodes are made three-dimensional with micrometric or nanometric dimensions to improve device functionality, then the device performance is improved, but the difficulty of obtaining electrical connection of their upper portion increases
Solution Approach 1:
The patent transitions from planar two-dimensional electrical connections to three-dimensional vertical connections by positioning connection terminals at opposite ends of the LED structure (upper and lower surfaces). This dimensional change allows electrical access from both sides of the encapsulation layer, facilitating connection of micrometric and nanometric three-dimensional LED structures that would be difficult to access from a single side.
3Reliability
If luminous elements are encapsulated in an insulating layer to prevent short-circuits and improve positioning tolerance, then the reliability and positioning accuracy are improved, but the ease of repair or substitution of defective luminous elements deteriorates
Solution Approach 1:
The patent segments the electrical connection path into two independent access points: upper connection terminals and lower connection terminals. The insulating encapsulation layer is configured with openings or access points at both upper and lower surfaces, allowing defective LEDs to be selectively replaced by accessing connection terminals from either side without requiring complete disassembly of the encapsulation structure.
4Manufacturing precision
If the positioning accuracy of luminous elements is increased to achieve best resolution, then the display quality is improved, but the manufacturing complexity and cost increase due to difficulty of precise positioning
Solution Approach 1:
The insulating encapsulation layer serves as a mediator that decouples positioning precision requirements from electrical connection requirements. By providing a stable encapsulating matrix with embedded conductive pathways, it allows luminous elements to be positioned with relaxed tolerance while maintaining reliable electrical connections through the encapsulation structure, thereby reducing manufacturing complexity.
Data Source
AI summary
The invention relates to an electronic system (10) comprising: an initial electronic device (7) comprising a lower connection terminal (9) and an upper connection terminal (11): a lower electrically conductive element (3) configured to be electrically connected to the initial electronic device (7): an electrically insulating spacer layer (5) configured to interact with the initial electronic device (7) in such a way as to ensure electrical insulation between the lower electrically conductive element (3) and the upper connection terminal (11): an upper electrically conductive element (13) configured to be connected to the upper connection terminal (11) of said at least one initial electronic device (7): a pre-existing structure giving access to the lower electrically conductive element (3) from an upper face of the electrically insulating spacer layer (5). The invention also relates to a method for producing such an electronic system (10).