LED Assembly with Integrated Active Cooling and Temperature Sensor
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Solution Overview
Problem
Conventional LED assemblies rely on passive heat sinks that are often overdesigned, leading to bulky sizes and inefficiencies, and may require additional power for active cooling systems that operate independently of the LED assembly.
Innovation Solution
An LED assembly with an integrated temperature sensor and active cooling circuit that powers a fan or similar active cooling system, allowing for adaptive temperature control without the need for a secondary power source, combining both passive and active cooling methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive heat sinks are used to cool the LED, then the LED temperature is controlled, but the assembly becomes bulky and requires excessive space
Solution Approach 1:
The patent combines the active cooling system with the LED assembly by integrating the fan and temperature sensor directly into the assembly structure, eliminating the need for separate bulky passive heat sinks while maintaining effective temperature control
Solution Approach 2:
The patent implements dynamic cooling control where the fan operates based on real-time temperature feedback from the sensor, adjusting cooling intensity to match actual thermal conditions rather than using fixed oversized passive cooling
2Temperature
If active cooling systems such as fans are used to cool the LED, then effective cooling at high temperatures is achieved, but a secondary power source is required
Solution Approach 1:
The patent makes the driver circuit perform multiple functions by adding a power conversion module that extracts and converts power from the LED driver to supply the active cooling fan, eliminating the need for a separate power source while maintaining LED driving functionality
Solution Approach 2:
The active cooling system serves itself by extracting power from the existing LED driver circuit through the power conversion module, making the cooling system self-powered without requiring external power sources or increasing system complexity
3Volume of moving object
If smaller heat sinks are used to reduce assembly size, then space requirements are reduced, but cooling effectiveness at high temperatures becomes insufficient
Solution Approach 1:
The patent uses dynamic control where the active cooling fan operates at variable intensities based on real-time temperature feedback, providing sufficient cooling power only when needed rather than relying on oversized static passive heat sinks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat in LED assemblies by reducing size and eliminating the need for bulky passive heat sinks while providing efficient temperature control using a single power source, enhancing performance and longevity.
Implementation Method 1
A temperature sensor monitors a temperature of the LED
Implementation Method 2
An active cooling system cools the LED
Data Source
AI summary
A light emitting diode (LED) assembly is provided having a LED and a temperature sensor for monitoring a temperature of the LED. An active cooling circuit receives temperature input from the temperature sensor. The temperature input is indicative of the temperature of the LED. An active cooling system cools the LED. The active cooling system being controlled by the active cooling circuit to control a temperature of the LED.