Light Emitting Device Adhesive Dipping Method
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Solution Overview
Problem
Existing light emitting devices face challenges in achieving improved luminance and luminous flux while maintaining simplified manufacturing processes, particularly in chip size packages where component reduction and process simplification are necessary to prevent detachment issues.
Innovation Solution
A method involving mounting a light emitting element on a support member, applying adhesive to its surface, and disposing a light-transmissive member via the adhesive, which includes dipping the element in the adhesive to form a resin fillet for enhanced adhesion and light reflection, thereby improving brightness and luminous flux.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the number of constituting components is reduced to achieve chip size package, then manufacturing process is simplified, but detachment occurrence may increase
Solution Approach 1:
The patent combines the adhesive application and light-transmissive member placement into a single integrated step. The adhesive is applied directly to the light emitting element, and the light-transmissive member is immediately disposed onto the adhesive while still wet, merging two separate manufacturing operations into one cohesive process that reduces complexity while ensuring reliable bonding.
Solution Approach 2:
The adhesive is applied to the light emitting element before the light-transmissive member is disposed, creating a pre-prepared bonding surface. This preliminary action ensures that the adhesive is in optimal condition for bonding when the light-transmissive member is placed, preventing detachment while maintaining process simplicity.
2Ease of manufacture
If adhesive is applied by dipping method, then manufacturing process is simplified, but adhesive application precision may deteriorate
Solution Approach 1:
The dipping method is optimized by controlling the dip depth, speed, and angle to ensure adhesive is applied precisely where needed on the light emitting element surface. The process creates localized adhesive distribution patterns that are sufficient for bonding the light-transmissive member without requiring complex application equipment.
Solution Approach 2:
The dipping process allows the adhesive to naturally spread and conform to the light emitting element surface through capillary action and surface tension, eliminating the need for precise mechanical positioning or complex application mechanisms. The adhesive self-adjusts to create an optimal bonding layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of light emitting devices with enhanced luminance and luminous flux while maintaining a simplified manufacturing process, reducing the risk of detachment and facilitating mass production.
Implementation Method 1
applying an adhesive to the first surface of the light emitting element by holding the support member and dipping the first surface of the light emitting element in the adhesive
Implementation Method 2
disposing a light-transmissive member on the first surface of the light emitting element via the adhesive... forming a resin fillet for enhanced adhesion and light reflection
Data Source
AI summary
A method of manufacturing a light emitting device includes: mounting at least one light emitting element on a support member with a first surface of the light emitting element facing upward; applying an adhesive to the first surface of the light emitting element by holding the support member and dipping the first surface of the light emitting element in the adhesive; and disposing a light-transmissive member on the first surface of the light emitting element via the adhesive.