Light Emitting Device with Heat-Resistant Adhesive Layer
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Solution Overview
Problem
Existing light emitting devices using LEDs and fluorescent materials face challenges in suppressing color shifts and have complex, costly manufacturing processes, particularly due to direct heat transfer to fluorescent materials and the need for multiple concave sections and fluorescent layers.
Innovation Solution
A light emitting device structure featuring a substrate with light emitting elements mounted on a metal substrate, electrically connected via a wiring pattern or metal plates, and sealed with layers of fluorescent materials to manage heat and color stability, allowing for easier manufacturing and reduced color shifts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If light emitting diode element is secured on glass epoxy substrate with fluorescent material containing layer interposed therebetween, then light emission luminance is improved, but heat generated in light emitting diode element directly releases to fluorescent material causing alteration and color shifts
Solution Approach 1:
The patent introduces a heat-resistant adhesive layer as an intermediary between the light emitting diode element and the fluorescent material containing layer. This adhesive layer has higher heat resistance than conventional adhesives, preventing direct heat transfer to the fluorescent material while maintaining electrical and mechanical connection. This resolves the contradiction by allowing high luminance operation without compromising fluorescent material stability.
2Stability of the object's composition
If two concave sections and two LED chips are mounted with two kinds of fluorescent material layers, then chromaticity shifts are restrained, but structure becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent merges multiple fluorescent materials into a single fluorescent material containing layer that is applied to one light emitting diode element. Instead of using two separate LED chips with different fluorescent materials, the invention combines the fluorescent materials in one layer, simplifying the structure while maintaining chromaticity stability through the heat-resistant adhesive that prevents material alteration.
3Stability of the object's composition
If two concave sections and two LED chips are mounted with two kinds of fluorescent material layers, then chromaticity shifts are restrained, but manufacturing processes become complicated
Solution Approach 1:
The patent combines multiple fluorescent materials into a single layer applied to one LED chip, reducing the number of mounting and sealing operations required. This merging approach simplifies the manufacturing process while maintaining chromaticity stability through the use of heat-resistant adhesive that prevents color shifts during operation.
4Stability of the object's composition
If two concave sections and two LED chips are mounted with two kinds of fluorescent material layers, then chromaticity shifts are restrained, but manufacturing cost becomes high
Solution Approach 1:
The patent reduces manufacturing cost by merging multiple fluorescent materials into a single layer applied to one LED chip, eliminating the need for two separate LED chip mounting operations. The chromaticity stability is maintained through the heat-resistant adhesive that prevents fluorescent material degradation, avoiding the need for complex multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively suppresses color shifts and simplifies the manufacturing process, enabling the production of light emitting devices with stable chromaticity and improved luminance, suitable for applications like liquid crystal displays and illumination sources.
Implementation Method 1
a first sealing member layer that is formed so as to cover the light emitting elements and contains a first fluorescent material, and a second sealing member layer that is formed on the first sealing member layer and contains a second fluorescent material
Data Source
AI summary
By using a light emitting device including a substrate and a light emitting unit, the light emitting unit including: a plurality of light emitting elements that are mounted on substrate and electrically connected to external electrodes; a first sealing member layer containing a first fluorescent material, formed to cover light emitting elements; and a second sealing member layer containing a second fluorescent material, formed on first sealing member layer, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device capable of suppressing color shifts and the like by the fluorescent materials, and of being easily manufactured, as well as a method for manufacturing the same.